公开(公告)号：US20210111141A1

公开(公告)日：2021-04-15

申请号：US16599738

申请日：2019-10-11

Applicant: GLOBALFOUNDRIES INC.

Inventor： Wolfgang SAUTER ,  Mark W. KUEMERLE ,  Eric W. TREMBLE

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.