Electron emission from a cold cathode
    1.
    发明授权
    Electron emission from a cold cathode 失效
    电子从冷阴极发射

    公开(公告)号:US3872489A

    公开(公告)日:1975-03-18

    申请号:US33527373

    申请日:1973-02-22

    CPC classification number: H01J1/308

    Abstract: An electron emitter comprising a body of a wide band gap material using double injection space-charge limited current. By using double injection of carriers to establish space-charge limited currents in high resistivity p-type semiconductors, the number of minority carriers can be increased considerably without raising the Fermi level above mid band gap. By using such double injection space-charge limited current a sufficient amount of large energy minority carriers are placed in the conduction band in a p-type semiconductor. A monoatomic layer of cesium and oxygen is positioned on the positively biased contact. This places a negative electron affinity surface layer on the device. The electrons in the conduction band then have enough energy to impel electrons into a vacuum.

    Abstract translation: 一种电子发射器,包括使用双注入空间电荷限制电流的宽带隙材料体。 通过使用双重注入载流子在高电阻率p型半导体中建立空间电荷限制电流,可以显着增加少数载流子的数量,而不会使费米能级高于中间带隙。 通过使用这种双注入空间电荷限制电流,在p型半导体中的导带中放置足够量的大能量少数载流子。 铯和氧的单原子层位于正偏压接触件上。 这在设备上放置负电子亲和性表面层。 导带中的电子然后具有足够的能量来推动电子进入真空。

    Method and apparatus for forming an ohmic contact to high-resistivity silicon
    2.
    发明授权
    Method and apparatus for forming an ohmic contact to high-resistivity silicon 失效
    用于形成OHMIC接触高电阻硅的方法和装置

    公开(公告)号:US3637972A

    公开(公告)日:1972-01-25

    申请号:US3637972D

    申请日:1970-04-01

    CPC classification number: H01L21/67138 H01R43/02

    Abstract: A method of forming an ohmic contact between a conductor and a silicon substrate having a resistivity greater than 5 ohm-cm. by etching the substrate, heating it in an atmosphere of inert gas, pressing the conductor into contact with the substrate, and allowing sufficient current to flow through the conductor and the substrate to form the contact.

    Abstract translation: 在导体和电阻率大于5欧姆 - 厘米的硅衬底之间形成欧姆接触的方法。 通过蚀刻基板,在惰性气体气氛中加热,将导体按压与基板接触,并允许足够的电流流过导体和基板以形成接触。

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