公开(公告)号：US12237298B1

公开(公告)日：2025-02-25

申请号：US18914153

申请日：2024-10-12

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Jian Gao ,  Guocong Chen ,  Lanyu Zhang ,  Haixiang Deng

IPC: H01L23/00 ,  G05B19/4155

Abstract: A cooperative bonding method for a bonding head of a wire bonding machine, including setting an initial height value of the vertical lifting mechanism to be a difference value; upon receiving a bonding instruction, controlling the bonding head to perform an positioning operation on the target processing chip, controlling the vertical lifting mechanism to descend a preset distance; during the positioning operation of the bonding head on the target processing chip, when the acceleration motion and the overshoot is completed, controlling the vertical lifting mechanism to rise back; and during the rise back process, the pad of the chip does not exceed a residual vibration curve of the bonding head. This achieves the technical effect of improving the bonding efficiency of the bonding head within a small searching area while avoiding impacts on the chip caused by the overshoot during high acceleration positioning of the bonding head.

公开(公告)号：US12106999B2

公开(公告)日：2024-10-01

申请号：US17229017

申请日：2021-04-13

Applicant: Guangdong University of Technology

Inventor： Jian Gao ,  Wenxiu Lai ,  Guocong Chen ,  Lanyu Zhang ,  Yachao Liu ,  Yongbin Zhong ,  Yuheng Luo ,  Huawen Lin

IPC: H01L21/687 ,  H01L21/68 ,  H01L25/075

CPC classification number: H01L21/68764 ,  H01L21/68 ,  H01L21/68757 ,  H01L25/0753

Abstract: A decoupled XY parallel micro-positioning stage, including a central moving platform, fixed mechanisms, bridge-type micro-displacement amplification mechanisms, a four-bar symmetrical flexible guide mechanism and a piezoelectric ceramic. Each fixed mechanism is arranged between adjacent amplification mechanisms and is symmetrical about X and Y axes centered on the moving platform. The amplification mechanism is symmetrically arranged with respect to the X and Y axes, and includes two first and second longitudinal beams and multiple crossbeams. The two first longitudinal beams are provided in parallel and spaced apart. The two second longitudinal beams are arranged spaced apart between the two first longitudinal beams, and are connected to the two first longitudinal beams via the crossbeams. The crossbeams are connected to the longitudinal beams via a flexible hinge. The piezoelectric ceramic is arranged between the two first longitudinal beams.