HEATSINKS AND THERMAL ARCHITECTURE OF AN IMAGE CAPTURE DEVICE

    公开(公告)号:US20240414422A1

    公开(公告)日:2024-12-12

    申请号:US18813589

    申请日:2024-08-23

    Applicant: GoPro, Inc.

    Abstract: An image capture device including: heat generating devices, one or more batteries, and a sensor heat spreader. The heat generating devices generate a thermal load. The sensor heat spreader is in thermal communication with one or more of the heat generating devices and extends from the one or more of the heat generating devices to the one or more batteries so that all or a portion of the thermal load is transferred to the one or more batteries.

    BATTERY THERMAL MANAGEMENT
    2.
    发明公开

    公开(公告)号:US20240014458A1

    公开(公告)日:2024-01-11

    申请号:US18218812

    申请日:2023-07-06

    Applicant: GoPro, Inc.

    CPC classification number: H01M10/615 H01M10/635 H01M10/623 H01M10/443

    Abstract: Heating of an image capture apparatus battery to an operational temperature using an attached heater device is described. The image capture apparatus includes an image capture apparatus battery configured to functionally operate at a first operational temperature. The heater device includes a heater device battery configured to operate at a second operational temperature lower than the first operational temperature. A heater controller is implemented in one of the image capture apparatus or the heater device. The heater controller is configured to initiate a heating process based on a first defined event, set a current level of the heater device, maintain or adjust the current level of the heater device until a second defined event, and display an indication that the image capture apparatus can detect, capture, or record an image based on the image capture apparatus battery attaining the first operational temperature.

    HEAT CONDUCTOR ASSEMBLY
    9.
    发明申请

    公开(公告)号:US20240393665A1

    公开(公告)日:2024-11-28

    申请号:US18649487

    申请日:2024-04-29

    Applicant: GoPro, Inc.

    Abstract: An image capture apparatus includes first and second image sensors that generates heat and are opposed a space from each other and a housing assembly that encloses the first and second image sensors. The image capture apparatus includes first and second circuit boards that are connected respectively and separately with the first and second image sensors, and the first and second circuit boards include a peripheral edge that extends from the first and second image sensors to an outside of the housing assembly. The image capture apparatus includes a heatsink assembly positioned on the outside of the housing assembly and a heat conductor assembly that is extended between the heatsink assembly and the first and second circuit boards.

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