MEMS device with a valve mechanism

    公开(公告)号:US10212501B2

    公开(公告)日:2019-02-19

    申请号:US15505001

    申请日:2014-08-27

    Applicant: Goertek.Inc

    Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

    MEMS DEVICE WITH A VALVE MECHANISM
    2.
    发明申请

    公开(公告)号:US20170280218A1

    公开(公告)日:2017-09-28

    申请号:US15505001

    申请日:2014-08-27

    Applicant: Goertek.Inc

    Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

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