公开(公告)号：US20180069149A1

公开(公告)日：2018-03-08

申请号：US15559801

申请日：2015-11-04

Applicant: Goertek.Inc

Inventor： Quanbo ZOU ,  Manen LU ,  Zhe WANG

IPC: H01L33/00 ,  H01L27/15 ,  H01L25/075 ,  H01L33/20 ,  H01L21/68 ,  H01L21/786

CPC classification number: H01L33/0095 ,  H01L21/68 ,  H01L21/786 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/0079 ,  H01L33/20

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.