公开(公告)号：US20180069148A1

公开(公告)日：2018-03-08

申请号：US15559778

申请日：2015-09-09

Applicant: Goertek.Inc

Inventor： Quanbo ZOU ,  Zhe WANG

IPC: H01L33/00 ,  H01L23/00 ,  H01L33/48 ,  H01L25/13

CPC classification number: H01L33/0095 ,  H01L24/03 ,  H01L25/0753 ,  H01L25/13 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/83 ,  H01L2224/98 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2933/0066

Abstract: The present invention discloses a repairing method, manufacturing method, device and electronics apparatus of micro-LED. The method for repairing a micro-LED comprises: bringing a known-good micro-LED on a conductive pick-up head into contact with a first pad on an defective position of a receiving substrate, wherein the conductive pick-up head and the known-good micro-LED are bonded via a conductive adhesive; locally joule heating a first bonding layer through the conductive pick-up head, to melt the first bonding layer, wherein the first bonding layer is provided between the known-good micro-LED and the first pad; and lifting up the conductive pick-up head after the first bonding layer is cooled, leaving the known-good micro-LED on the receiving substrate.

公开(公告)号：US20180069149A1

公开(公告)日：2018-03-08

申请号：US15559801

申请日：2015-11-04

Applicant: Goertek.Inc

Inventor： Quanbo ZOU ,  Manen LU ,  Zhe WANG

IPC: H01L33/00 ,  H01L27/15 ,  H01L25/075 ,  H01L33/20 ,  H01L21/68 ,  H01L21/786

CPC classification number: H01L33/0095 ,  H01L21/68 ,  H01L21/786 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/0079 ,  H01L33/20

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.