公开(公告)号：US20230223172A1

公开(公告)日：2023-07-13

申请号：US18117042

申请日：2023-03-03

Applicant: Greatbatch Ltd.

Inventor： Brian P. Hohl ,  Dallas J. Rensel ,  Jonathan Calamel ,  Christine Frysz

IPC: H01B17/30 ,  B28B1/00 ,  H01B17/58 ,  B33Y10/00 ,  G06F30/10 ,  C04B35/626 ,  B33Y40/20 ,  C04B35/64 ,  B33Y80/00 ,  H01B19/00 ,  G06F113/10

CPC classification number: H01B17/301 ,  B28B1/001 ,  H01B17/58 ,  B33Y10/00 ,  G06F30/10 ,  C04B35/6269 ,  B33Y40/20 ,  C04B35/64 ,  B33Y80/00 ,  H01B19/00 ,  C04B2235/6026 ,  G06F2113/10

Abstract: A method for manufacturing a ceramic substrate by a 3D-printing process is described. The method comprises operating a 3D-printer to print a green-state ceramic body having a height extending to spaced apart first and second end surfaces and at least one via extending at least part-way along the height of the green-state ceramic body from the first end surface toward the second end surface. Then, the green-state ceramic body is sintered to provide the ceramic substrate with the at least one via. In cross-section, the at least one via has a square-shaped via with rounded corners.