公开(公告)号：US12289932B2

公开(公告)日：2025-04-29

申请号：US18769413

申请日：2024-07-11

Applicant: Guangdong University of Technology

Inventor： Yun Chen ,  Yanhui Chen ,  Li Ma ,  Hao Zhang ,  Jintao Chen ,  Maoxiang Hou ,  Xin Chen

IPC: H10H20/01 ,  H01L21/67

Abstract: An ejector pin sliding on membrane-based device and method for mass transfer of mini light-emitting diodes (Mini-LEDs) are provided. The device includes a gantry transverse beam. The gantry transverse beam is provided with an ejector pin base, and the ejector pin base is configured to move along the gantry transverse beam. The ejector pin base is fixedly provided with a vision camera and an ejector pin. A blue membrane is horizontally provided at a side of the gantry transverse beam close to the ejector pin, and is spaced from the gantry beam. A surface of a side of the blue membrane away from the gantry transverse beam is adhesively provided with a plurality of Mini-LED chips arranged evenly. A transfer substrate is horizontally provided at a side of the blue membrane close to the plurality of Mini-LED chips, and is spaced from the blue membrane.

公开(公告)号：US12261239B2

公开(公告)日：2025-03-25

申请号：US18769404

申请日：2024-07-11

Applicant: Guangdong University of Technology

Inventor： Yun Chen ,  Yanhui Chen ,  Li Ma ,  Pengwei Lv ,  Hao Zhang ,  Maoxiang Hou ,  Xin Chen

IPC: H01L33/00 ,  H01L21/68 ,  H01L21/683 ,  H01L25/075

Abstract: A device for mass transfer of Mini-LEDs based on array water jet-based ejection, including a planar motion platform, a vision camera, an array water jet-type ejection unit, a Z-axis motion platform, a blue membrane, an operation platform and a transfer substrate. The vision camera and the array water jet-type ejection unit are provided on a side of the planar motion platform. The array water jet-type ejection unit includes a water jet channel and a through-hole array. The Z-axis motion platform is provided at a side of the planar motion platform near the vision camera, and is configured for placement of the blue membrane. Multiple Mini-LED chips are bonded to the blue membrane. The operation platform is spacedly provided at a side of the Z-axis motion platform away from the planar motion platform.