公开(公告)号：US20250091164A1

公开(公告)日：2025-03-20

申请号：US18924368

申请日：2024-10-23

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/53 ,  B23K26/04 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/08 ,  B23K103/00

Abstract: A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

公开(公告)号：US20220009032A1

公开(公告)日：2022-01-13

申请号：US17288601

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/10 ,  B23K37/047 ,  B23K26/08 ,  B23K26/06

Abstract: A laser processing apparatus includes: a support portion configured to move along a first direction; a first moving portion configured to move along a second direction orthogonal to the first direction; a first attachment portion configured to move along a third direction orthogonal to the first direction and the second direction; a first laser processing head attached to the first attachment portion; a light source unit; and a first mirror attached to the first moving portion. The first laser processing head includes a first entrance portion and a first condensing portion. The light source unit includes a first emission portion. The first mirror is attached to the first moving portion to face the first emission portion in the second direction and face the first entrance portion in the third direction.

公开(公告)号：US20220009038A1

公开(公告)日：2022-01-13

申请号：US17288620

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/53 ,  B23K26/08 ,  B23K26/04 ,  B23K26/06

Abstract: A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

公开(公告)号：US20210010803A1

公开(公告)日：2021-01-14

申请号：US17040800

申请日：2018-12-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: G01B11/14 ,  G02B7/10

Abstract: A distance measurement unit includes: a distance measurement light source that outputs distance measurement light; an objective lens through which the distance measurement light and reflected light are transmitted; an imaging lens through which the reflected light is transmitted and which forms an image at an imaging position; an optical path adjustment unit that adjusts an optical path of the reflected light; and a light detection unit that detects the reflected light. The objective lens allows the distance measurement light to be transmitted therethrough in a state in which an optical path of the distance measurement light is spaced apart from a central axis of the objective lens. The optical path adjustment unit adjusts the optical path so that the imaging position of the reflected light approaches a predetermined plane. A light reception surface of the light detection unit is located to follow along the predetermined plane.

公开(公告)号：US20190030644A1

公开(公告)日：2019-01-31

申请号：US16072626

申请日：2017-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA ,  Mitsuhiro NAGAO ,  Yasunori IGASAKI

IPC: B23K26/06 ,  H01S3/10 ,  B23K26/53 ,  B23K26/03

Abstract: A laser processing device includes: a device frame; a support unit attached to the device frame and configured to support an object to be processed; a laser output unit attached to the device frame; and a laser converging unit attached to the device frame so as to be movable with respect to the laser output unit. The laser output unit includes a laser light source configured to emit laser light, and the laser converging unit includes: a reflective spatial light modulator configured to reflect the laser light while modulating the laser light; a converging optical system configured to converge the laser light at the object to be processed; and an imaging optical system constituting a double telecentric optical system in which a reflective surface of the reflective spatial light modulator and an entrance pupil plane of the converging optical system are in an imaging relationship.

公开(公告)号：US20210402516A1

公开(公告)日：2021-12-30

申请号：US17289011

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/08 ,  B23K26/351 ,  B23K26/06

Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

公开(公告)号：US20210398856A1

公开(公告)日：2021-12-23

申请号：US17288613

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: H01L21/78 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/18 ,  H01L21/67

Abstract: A laser processing method includes a laser light emitting step of emitting a pulsed laser light along a line from a back surface of a target having a functional element layer on side of a front surface. The laser light emitting step includes: a first step of irradiating the functional element layer with a first pulsed laser light along the line, to form a weakened region in the functional element layer along the line; and a second step of emitting a second pulsed laser light into the target to follow the first pulsed laser light along the line, to form a crack reaching the front surface along the line in the target. The first pulsed laser light has a pulse width that is shorter than a pulse width of the second pulsed laser light.

公开(公告)号：US20210394303A1

公开(公告)日：2021-12-23

申请号：US17288821

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/04 ,  B23K26/03 ,  B23K26/064 ,  G01B11/14 ,  G02B27/10 ,  G02B13/22

Abstract: A laser processing head includes: a housing; an entrance portion; an adjustment portion; and a condensing portion. A distance between a third wall portion and a fourth wall portion facing each other in a second direction is shorter than a distance between a first wall portion and a second wall portion facing each other in a first direction. The housing is configured to be attached to an attachment portion of a laser processing apparatus, with at least one of the first wall portion, the second wall portion, the third wall portion, and a fifth wall portion disposed on the side of the attachment portion. The condensing portion is disposed on a sixth wall portion, and is offset toward the fourth wall portion in the second direction.

公开(公告)号：US20200290157A1

公开(公告)日：2020-09-17

申请号：US16760094

申请日：2018-10-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/53 ,  B23K26/00 ,  B23K26/03 ,  B23K26/062 ,  B23K26/064 ,  G01N21/55 ,  G06T7/70

Abstract: A laser processing method includes a first step of emitting measurement laser light of a first wavelength from the reference surface side to a reference object having a reference surface of which reflectance for the first wavelength is known to obtain a reference light amount as a reflected light amount of the measurement laser light on the reference surface, a second step of emitting the measurement laser light from the first surface side to the object to be processed to obtain a first light amount as a reflected light amount of the measurement laser light on the first surface, and a third step of, after the first step and the second step, calculating a reflectance of the first surface for the first wavelength based on a reflectance of the reference object, the reference light amount, and the first light amount.

公开(公告)号：US20190039169A1

公开(公告)日：2019-02-07

申请号：US16073504

申请日：2017-01-23

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/00 ,  B23K26/03 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/53

Abstract: A laser processing apparatus that performs laser processing on an object to be processed by irradiating the object with laser light along a line to process includes a support table, a laser light source, a converging unit, a moving unit, an actuator, a displacement sensor, a temperature sensor, and a control unit. The control unit calculates the amount of driving of a converging unit that is performed by the actuator on the basis of a displacement of an incidence surface measured by the displacement sensor and a temperature of the converging unit detected by the temperature sensor, and controls the actuator such that the converging unit is driven according to the amount of driving when the moving unit relatively moves a converging point.