公开(公告)号：US10679930B2

公开(公告)日：2020-06-09

申请号：US15780189

申请日：2016-11-28

Applicant: HANA MICRON INC.

Inventor： Hyun Woo Lee ,  Jin Wook Jeong ,  Hyun Joo Kim ,  Jin Young Ock

IPC: H01L23/49 ,  H01L23/00 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L25/07 ,  H01L25/10 ,  H01L23/498 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  H01L23/488 ,  H01L21/48 ,  H01L21/56

Abstract: A fan-out wafer level package is disclosed, which includes: a redistribution layer; a semiconductor chip electrically connected with the redistribution layer through a bump; a protective member protecting the semiconductor chip, wherein a part of the protective member is removed such that the upper surface of the semiconductor chip is exposed in order to dissipate heat and prevent warpage; and an interconnector disposed outside the semiconductor chip at substantially the same level and having a lower part electrically connected with the redistribution layer and an upper part not being covered with the protective member, wherein the interconnector includes a metal core solder ball, the metal core solder ball includes a metal core and a solder buffer between the metal core and the protective member, and the metal core is formed of a combination of copper (Cu), nickel (Ni), and silver (Ag).