公开(公告)号：US20240145653A1

公开(公告)日：2024-05-02

申请号：US18196453

申请日：2023-05-12

Applicant: HANNSTAR DISPLAY CORPORATION

Inventor： Chun-I Chu ,  Yu-Chi Chiao ,  Yung-Li Huang ,  Hung-Ming Chang ,  Cheng-Yu Lin ,  Huan-Hsun Hsieh ,  CHeng-Pei Huang

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/44 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/505 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: A manufacturing method of a display device includes forming light emitting components on a first substrate, the light emitting components include a first side and a second side, and the second side is away from the first substrate; forming a circuit layer on the first substrate and on the second side of the light emitting components; forming a first protective layer on the circuit layer and forming an insulating layer on the first protective layer; removing the first substrate after forming a second substrate on the insulating layer; forming a black matrix layer on the first side of the light emitting components, and the black matrix layer includes openings; forming light conversion layers in the openings of the black matrix layer; forming a second protective layer on the black matrix layer and the light conversion layers; and forming a third substrate on the second protective layer.

公开(公告)号：US20240237232A1

公开(公告)日：2024-07-11

申请号：US18314144

申请日：2023-05-09

Applicant: HannStar Display Corporation

Inventor： Pei-Hao Hung ,  Chun I Chu ,  Chia Lin Liu ,  Yung-Li Huang

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/16 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K3/4644 ,  H05K1/0298 ,  H05K3/16 ,  H05K3/188 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2081 ,  H05K2203/05

Abstract: A circuit board including a substrate, a first circuit layer, a first insulating layer, a second circuit layer, and a solder resist layer is provided. The first circuit layer is disposed on the substrate. The first insulating layer is disposed on the substrate and covers a portion of the first circuit layer. The second circuit layer is disposed on the first insulating layer and penetrates a portion of the first insulating layer to electrically connect the first circuit layer. The solder resist layer is disposed on the substrate and covers a portion of the second circuit layer.

公开(公告)号：US20140078691A1

公开(公告)日：2014-03-20

申请号：US13727613

申请日：2012-12-27

Applicant: HANNSTAR DISPLAY CORPORATION

Inventor： Yung-Li Huang ,  Yu-Sheng Lin ,  Nan-Cheng Huang ,  Jih-Hsin Chiang

IPC: H05K1/18

CPC classification number: H05K1/181 ,  G06F3/0416 ,  H05K1/0268 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09663

Abstract: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.

Abstract translation: 触摸面板和柔性电路板的接合结构包括触摸面板，柔性电路板和导电粘合剂薄膜。 触摸面板包括屏蔽层和设置在屏蔽层上的多个传输线。 柔性电路板位于触摸面板的下面，包括基板和基板上的多个连接线。 每个连接线包括第一连接部分和第二连接部分，并且两个连接部分彼此隔开间隔并彼此电绝缘。 导电粘合膜位于触摸屏的传输线与柔性电路板的连接线之间，其中连接线的第一连接部分和第二连接部分经由导电粘合膜电连接到传输线 从而形成电路。

公开(公告)号：US20230162975A1

公开(公告)日：2023-05-25

申请号：US17970610

申请日：2022-10-21

Applicant: HannStar Display Corporation

Inventor： Yu-Chi Chiao ,  Yung-Li Huang ,  Chun I Chu ,  Sheng Wei Chou

IPC: H01L21/02

CPC classification number: H01L21/02458 ,  H01L21/0254

Abstract: The disclosure provides a manufacturing method of a nitride semiconductor structure. The method includes the followings. Multiple island structures separated from each other are formed on a sapphire substrate. A GaN layer is formed on the island structures. A silicon substrate is bonded to a surface of the GaN layer facing away from the sapphire substrate. The sapphire substrate, the island structures, and a first sublayer of the GaN layer are removed. The first sublayer of the GaN layer has multiple voids, and the voids are located between the island structures.

公开(公告)号：US09532456B2

公开(公告)日：2016-12-27

申请号：US13727613

申请日：2012-12-27

Applicant: Hannstar Display Corporation

Inventor： Yung-Li Huang ,  Yu-Sheng Lin ,  Nan-Cheng Huang ,  Jih-Hsin Chiang

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/32 ,  G06F3/041 ,  H05K3/36

CPC classification number: H05K1/181 ,  G06F3/0416 ,  H05K1/0268 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09663

Abstract: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.

Abstract translation: 触摸面板和柔性电路板的接合结构包括触摸面板，柔性电路板和导电粘合剂膜。 触摸面板包括屏蔽层和设置在屏蔽层上的多个传输线。 柔性电路板位于触摸面板的下面，包括基板和基板上的多个连接线。 每个连接线包括第一连接部分和第二连接部分，并且两个连接部分彼此隔开间隔并彼此电绝缘。 导电粘合膜位于触摸屏的传输线与柔性电路板的连接线之间，其中连接线的第一连接部分和第二连接部分通过导电粘合膜电连接到传输线 从而形成电路。