公开(公告)号：US11249265B2

公开(公告)日：2022-02-15

申请号：US16920487

申请日：2020-07-03

Applicant: US Conec, Ltd ,  Hewlett Packard Enterprise Development LP

Inventor： Paul Kessler Rosenberg ,  George Panotopoulos ,  Kent Devenport ,  Darrell R. Childers ,  Cecil D. Hastings, Jr. ,  Daniel D. Kurtz

IPC: G02B6/42 ,  G02B6/38

Abstract: An optical connector assembly (OCA) includes a connector housing to maintain alignment between optical components housed within the OCA and photoelectric converters on an optoelectronic substrate (OES) assembly. The optical components include a ferrule and an optical cable. The ferrule is optically coupled to the optical cable. The OCA includes a ferrule holder to hold the ferrule within the OCA, and a spring located between the connector housing and the ferrule holder. The spring is to apply a separating force between the ferrule holder and the connector housing. The OCA includes a gasket coupled to the connector housing. The coupling of the connector housing to a socket compresses the gasket to provide a seal between the connector housing and the socket.

公开(公告)号：US20210341690A1

公开(公告)日：2021-11-04

申请号：US16863610

申请日：2020-04-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Kevin B. Leigh ,  Michael Renne Ty Tan

IPC: G02B6/42

Abstract: Optoelectronic systems and methods of assembly thereof are described herein according to the present disclosure. An example of an optoelectronic described herein includes a substrate and an interposer coupled to the substrate including one or more optical emitters and one or more photodetectors to be mounted thereto. The interposer is fabricated with one or more mechanical datums located on the interposer with respect to flip chip pads to position and couple the optical emitters and photodetectors to the interposer. The optoelectronic system also includes an optical connector and an optical socket that includes one or more mechanical datums corresponding to the mechanical datums of the interposer. The optical socket is configured to align the optical connector with the optical emitters and the photodetectors when the optical socket is coupled to the substrate and the optical connector is received within the optical socket. The mechanical datums of the optical socket contact respective mechanical datums of the interposer when the optical socket is coupled to the substrate.

公开(公告)号：US10895688B2

公开(公告)日：2021-01-19

申请号：US16694592

申请日：2019-11-25

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  Paul Kessler Rosenberg ,  Sagi Mathai ,  Mir Ashkan Seyedi ,  Michael Renne Ty Tan ,  Wayne Victor Sorin ,  Marco Fiorentino

IPC: G02B6/30

Abstract: In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.

公开(公告)号：US10795103B2

公开(公告)日：2020-10-06

申请号：US16175652

申请日：2018-10-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Paul Kessler Rosenberg ,  Sagi Mathai ,  Michael Renne Ty Tan

IPC: G02B6/42 ,  G02B6/38 ,  G02B6/44

Abstract: Optoelectronic devices with a support member and methods of manufacturing or assembling the same are provided. An example of an optoelectronic device according to the present disclosure includes a substrate and an optical component and an electronic component disposed thereon or therein. The optoelectronic device further includes a ferrule coupled to the optical fiber and an optical socket receiving the ferrule therein. The optoelectronic device includes a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member.

公开(公告)号：US20180052284A1

公开(公告)日：2018-02-22

申请号：US15555733

申请日：2015-04-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Joaquin Matres ,  Michael Renee Ty Tan ,  Sagi Mathai ,  Wayne Victor Sorin ,  Paul Kessler Rosenberg

IPC: G02B6/293 ,  G02B1/11

CPC classification number: G02B6/29367 ,  G02B1/11 ,  G02B6/1225 ,  G02B6/124 ,  G02B6/2938 ,  G02B6/4215 ,  G02B6/4246

Abstract: An example device in accordance with an aspect of the present disclosure includes a slab to transmit light, and a plurality of lenses and filters disposed on first and second surfaces of the slab. The lenses include an anti-reflective coating on at least one of the plurality of lenses at an end of the slab to couple light through the anti-reflective coating, and a reflective coating disposed on remaining ones of the plurality of lenses to cause the lenses to reflect light. The filters are offset from the lenses to form an optical zig-zag.

公开(公告)号：US11199673B2

公开(公告)日：2021-12-14

申请号：US16528182

申请日：2019-07-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Paul Kessler Rosenberg ,  Geza Kurczveil

IPC: H01L21/56 ,  G02B6/43 ,  G02B6/42

Abstract: Examples herein relate to optoelectronic systems or modules. In particular, implementations herein relate to an optoelectronic module or system that includes a substrate having opposing first and second sides and an optoelectronic component having opposing first and second sides flip chip assembled to the substrate. The optoelectronic component is configured to emit at least one optical signal to the substrate, receive at least one optical signal from the substrate, or both. The optoelectronic system further includes an underfill exclusion structure configured to prevent underfill material dispensed between the optoelectronic component and the substrate from flowing into an optical area or path of the at least one optical signal transmitted between the optoelectronic component and the substrate. The underfill exclusion structure is spaced apart from at least one of the optoelectronic component or the substrate.

公开(公告)号：US10564335B2

公开(公告)日：2020-02-18

申请号：US15555005

申请日：2015-04-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Sagi Varghese Mathai ,  Paul Kessler Rosenberg ,  Michael Renne Ty Tan

IPC: G02B5/28 ,  G02B5/20 ,  G02B6/293 ,  B29B11/00 ,  B29C45/14 ,  B29C70/84 ,  B29D11/00 ,  G02B7/00 ,  B29K105/20 ,  B29L11/00

Abstract: In the examples provided herein, an apparatus has an optically transparent block having a filter surface. The apparatus also has two or more filters, where each of the filters has thin films fabricated on an optically transparent substrate, and further wherein the thin films of the filters are coupled to the filter surface. Additionally, the apparatus has an optically transparent overmold material encasing the two or more filters, where the overmold material fills a volume between and above neighboring ones of the two or more filters.

公开(公告)号：US20200049909A1

公开(公告)日：2020-02-13

申请号：US16526374

申请日：2017-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Sagi Mathai ,  Michael Rene Ty Tan ,  Marco Fiorentino ,  Paul Kessler Rosenberg ,  David Kielpinski ,  Wayne Victor Sorin

IPC: G02B6/42 ,  G02B6/34 ,  H01L23/544

Abstract: In some examples a silicon photonic (SiPh) solder reflowable assembly may comprise a silicon interposer bonded to an organic substrate, the silicon interposer having an optical grating disposed on the interposer to couple an optical signal, a lens array chip, the lens array comprising one or more lenses on a wafer, the lens array chip flip chip reflowed to the silicon interposer by a bonding agent and the one or more lenses having a predetermined shape that expands, collimates, and tilts a beam of the optical signal exiting the grating. The wafer has a coefficient of thermal expansion (CTE) that matches silicon and the one or more lenses and the grating are aligned in such a way the optical signal enters the grating at a desired angle.

公开(公告)号：US10473871B2

公开(公告)日：2019-11-12

申请号：US15112363

申请日：2014-01-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin B Leigh ,  Paul Kessler Rosenberg ,  George D Megason

IPC: G02B6/42 ,  G02B6/43

Abstract: An optoelectronic assembly for a printed circuit board (PCB) assembly is described herein. The optoelectronic assembly may include a component carrier for mounting an active component, and a connector assembly for achieving a coupling between the component carrier and PCB-side optical infrastructure on a printed circuit board (PCB). The connector assembly can include a plurality of optical fibers connected to the component carrier, a first optical connector connected to the optical fibers for coupling with the PCB-side optical infrastructure on the PCB, and a housing member for housing the optical fibers and the first optical connector.

公开(公告)号：US20190018203A1

公开(公告)日：2019-01-17

申请号：US15650197

申请日：2017-07-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Paul Kessler Rosenberg ,  Sagi Mathai ,  Michael Tan

IPC: G02B6/38

Abstract: An example adaptor for passively aligning an optical component of an optical connector with a ferrule of the optical connector. The adaptor may include first alignment feature and second alignment features. The first alignment features may be to, when the adaptor is connected to the ferrule, cooperate with alignment features of the ferrule to passively force the adaptor into a first configuration relative to the ferrule. The second alignment features may be arranged such that, when the optical component is held in contact with the second alignment features and the adaptor is in the first configuration relative to the ferrule, the optical component is in an aligned position relative to the ferrule.