公开(公告)号：US20180173073A1

公开(公告)日：2018-06-21

申请号：US15563150

申请日：2015-07-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  WEI KUANG CHU ,  KEVIN VOSS

IPC: G02F1/167 ,  G02B5/22 ,  G06F1/16

CPC classification number: G02F1/167 ,  G02B5/22 ,  G02F2001/1678 ,  G02F2203/01 ,  G06F1/1637

Abstract: An electrophoretic privacy device may include an electrophoretic cell coupled between a first electrode and a second electrode. The electrophoretic cell may comprise a plurality of semi-transparent positively-charged particles and a plurality of semi-transparent negatively-charged particles. The particles may be dispersed in a dielectric fluid in the electrophoretic cell. At least one of the first electrode and the second electrode may be transparent.

公开(公告)号：US20180041057A1

公开(公告)日：2018-02-08

申请号：US15542875

申请日：2015-04-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  CHIENLUNG YANG ,  KEVIN VOSS

IPC: H02J7/00

CPC classification number: H02J7/0042 ,  H02J7/0029

Abstract: Examples of charging devices are described. In an example, a charging device includes a planar supporting structure having a first surface and a second surface, where the first surface includes a plurality of projections extending from the first surface, each of the plurality of projections having a tip end. The first surface is coated with a thermal radiation coating and the tip end of each of the plurality of projections is coated with a thermal insulation coating. Further, a portion of the second surface is coated with a thermal conductive coating.

公开(公告)号：US20170313022A1

公开(公告)日：2017-11-02

申请号：US15517699

申请日：2014-12-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KEVIN VOSS ,  KT (KUAN-TING) WU ,  JAMES CHANG

IPC: B32B3/30 ,  B32B7/02 ,  B32B33/00 ,  B05D7/00 ,  B05D5/08

CPC classification number: B32B3/30 ,  B05D5/083 ,  B05D7/52 ,  B32B7/02 ,  B32B33/00 ,  H04M1/0202

Abstract: A coated substrate may provide soft touch and superhydrophobicity. In example implementations herein, a substrate may be provided with a microstructure on at least a portion of at least one surface of the substrate. A first, water-based soft touch coating may be on at least a portion of the microstructure. A second, solvent-based superhydrophobic coating may be on at least a portion of the first coating.

公开(公告)号：US20190221498A1

公开(公告)日：2019-07-18

申请号：US16323090

申请日：2016-10-06

Applicant: HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  DAVID A. PIPHO ,  KEVIN VOSS

IPC: H01L23/433 ,  H01L21/48

CPC classification number: H01L23/433 ,  H01L21/4871 ,  H01L21/56 ,  H01L23/02 ,  H01L23/3675 ,  H01L23/42 ,  H01L2224/32245 ,  H01L2924/14 ,  H01L2924/16251

Abstract: In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between the electronic component and the thermal dissipation unit, and an adhesive sealant applied around the thermal interface material between the electronic component and the thermal dissipation unit.

公开(公告)号：US20190025895A1

公开(公告)日：2019-01-24

申请号：US16067766

申请日：2016-04-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  AI-TSUNG LI ,  YA-TING YEH ,  KEVIN VOSS ,  MICHAEL DELPIER

IPC: G06F1/20 ,  B32B33/00

Abstract: Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.

公开(公告)号：US20180213659A1

公开(公告)日：2018-07-26

申请号：US15746129

申请日：2015-08-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  KEVIN VOSS ,  YA-TING YEH

IPC: H05K5/02

CPC classification number: H05K5/02 ,  B05D3/06 ,  B05D3/10 ,  B05D3/12 ,  C03C17/42 ,  C03C2217/76 ,  C03C2218/31 ,  C03C2218/32

Abstract: Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sired portions, and may have greater hardness than the hydrophobic coating.