公开(公告)号：US20160208394A1

公开(公告)日：2016-07-21

申请号：US14913771

申请日：2013-08-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Roger A. McKay Jr ,  Patrick Sadik

IPC: C23F1/16

CPC classification number: C23F1/16 ,  B41J2/1609 ,  B41J2/1629 ,  B41J2/1631 ,  B81B2201/052 ,  B81C1/00119

Abstract: An example provides a method including providing a substrate including an area having a plurality of pores and etching the area of the substrate to remove the plurality of pores to form a recess in the substrate. In some examples, the recess may form, at least in part, a device.

Abstract translation: 一个实例提供了一种方法，包括提供包括具有多个孔的区域的基板并蚀刻基板的区域以去除多个孔以在基板中形成凹部。 在一些示例中，凹部至少部分地形成设备。