公开(公告)号：US11137581B2

公开(公告)日：2021-10-05

申请号：US16145105

申请日：2018-09-27

Applicant: HIMAX TECHNOLOGIES LIMITED

Inventor： Chih-Sheng Chang ,  Teng-Te Huang ,  Shu-Hao Hsu ,  Jun-Yu Zhan ,  Jen-Hui Lai

IPC: G02B13/00 ,  H01L27/146 ,  C03B23/22

Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.