公开(公告)号：US20170074807A1

公开(公告)日：2017-03-16

申请号：US15122484

申请日：2014-12-09

Applicant: HOYA CORPORATION

Inventor： Takahito NISHIMURA ,  Kazuki AOYAMA

IPC: G01N21/956 ,  G03F1/84 ,  G03F1/60

CPC classification number: G01N21/956 ,  G01N2021/95676 ,  G03F1/60 ,  G03F1/84

Abstract: Provided is a mask blank substrate being a substrate having two main surfaces, in which one of the two main surfaces of the mask blank substrate on a side on which a transfer pattern is formed has such a surface profile that, when a measurement region of 2.8 mm×2.1 mm of the main surface in a transfer pattern formation region is measured using a white light interferometer under conditions of a pixel number of 640×480, a power spectrum density at a spatial frequency of 1.0×10−2 μm−1 calculated from a result of the measurement is 6.0×107 nm4 or less.

Abstract translation: 提供了一种掩模基板，其是具有两个主表面的基板，其中掩模坯料基板的形成有转印图案的一侧的两个主表面之一具有这样的表面轮廓，当测量区域为2.8 在像素数为640×480的条件下，使用白光干涉仪测量转印图案形成区域中的主表面的mm×2.1mm，计算空间频率为1.0×10-2μm-1的功率谱密度 测定结果为6.0×10 7 nm 4以下。

公开(公告)号：US20150355537A1

公开(公告)日：2015-12-10

申请号：US14760506

申请日：2014-01-08

Applicant: HOYA CORPORATION

Inventor： Takeyuki YAMADA ,  Takahito NISHIMURA

IPC: G03F1/60 ,  C23C14/14 ,  B24B37/04 ,  C23C14/00 ,  G03F1/50 ,  G03F1/32

CPC classification number: G03F1/60 ,  B24B37/04 ,  C23C14/0036 ,  C23C14/0641 ,  C23C14/0676 ,  C23C14/14 ,  G03F1/32 ,  G03F1/50 ,  G03F1/80

Abstract: A method for manufacturing a low-defect and high-quality mask blank substrate with minimized transfer pattern defects and high mechanical strength, particularly such that the occurrence of a phenomenon where a portion of a transfer pattern and a principal surface of the substrate therebeneath are broken off together is minimized such that there is little pattern loss. The mask blank is manufactured by preparing a mask blank substrate (X) having a substrate principal surface (X1) polished using a polishing solution containing abrasive grains, etching the substrate principal surface (X1) using catalyst-referred etching so as to remove damaged portions from the principal surface (X1), and then depositing a thin film that forms a transfer pattern on the substrate principal surface (X1) of the substrate (X) by sputtering.

Abstract translation: 一种用于制造具有最小的转印图案缺陷和高机械强度的低缺陷和高质量掩模坯料的方法，特别是使得其中转印图案的一部分和其下的基板的主表面被破坏的现象的发生 一起减少，使得几乎没有图案损失。 通过制备具有使用含有磨粒的研磨液研磨的基板主面（X1）的掩模用空白基板（X），利用催化剂参照蚀刻来蚀刻基板主面（X1）来制造掩模板，以便去除损坏部分 从主表面（X1），然后通过溅射在衬底（X）的衬底主表面（X1）上沉积形成转印图案的薄膜。

公开(公告)号：US20150370160A1

公开(公告)日：2015-12-24

申请号：US14654753

申请日：2013-12-24

Applicant: HOYA CORPORATION

Inventor： Takeyuki YAMADA ,  Toshihiko ORIHARA ,  Takahito NISHIMURA

IPC: G03F1/60 ,  G03F1/80 ,  B24B29/02 ,  G03F1/24

CPC classification number: G03F1/60 ,  B24B29/02 ,  C03C15/00 ,  C03C23/0075 ,  G03F1/24 ,  G03F1/80 ,  G03F1/82

Abstract: Provided are a mask blank substrate processing device, a mask blank substrate processing method, a mask blank substrate fabrication method, a mask blank fabrication method, and a transfer mask fabrication method, for surface processing a mask blank substrate such that a high-level smoothness and a low-defect quality are satisfied. A mask blank substrate processing device (1) comprises: substrate support means (3) for supporting a substrate (Y); a catalytic surface plate (4) comprising a catalytic face (4a) which is positioned opposite the principal surface of the substrate (Y); relative movement means (5) for causing the catalytic face (4a) and the principal surface to move relative to each other in a state of being either in contact or in close proximity; first processing fluid supply means (6) which supplies a first processing fluid for CARE to the principal surface; and physical cleaning means (7) for removing foreign matter which has adhered to the principal surface from the principal surface, using a physical action.

Abstract translation: 提供掩模空白基板处理装置，掩模基板处理方法，掩模坯料制造方法，掩模坯料制造方法和转印掩模制造方法，用于对掩模坯料基板进行表面处理，使得高级平滑度 并且满足低缺陷质量。 掩模空白基板处理装置（1）包括：用于支撑基板（Y）的基板支撑装置（3）; 催化表面板（4），其包括与所述基板（Y）的主表面相对定位的催化面（4a）; 相对运动装置（5），用于使催化面（4a）和主表面在接触或接近的状态下相对于彼此移动; 第一处理流体供应装置（6），其向主表面供应用于CARE的第一处理流体; 以及用于通过身体动作从主表面去除附着到主表面的异物的物理清洁装置（7）。