公开(公告)号：US20150146396A1

公开(公告)日：2015-05-28

申请号：US14593614

申请日：2015-01-09

Applicant: HZO, INC.

Inventor： Max Sorenson ,  Blake Stevens ,  Alan Rae ,  Marc Chason

IPC: H05K3/28 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H05K1/185 ,  H05K13/00 ,  H05K2201/09872 ,  Y10T29/49002 ,  Y10T29/49117

Abstract: A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

Abstract translation: 防潮电子设备包括至少一部分至少部分被防潮涂层覆盖的电子部件。 防潮涂层可以位于电子设备的内部。 防潮涂层可以仅覆盖电子设备内的内部空间的边界的一部分。 耐湿涂层可以包括一个或多个可辨别的边界或接缝，其可以位于或邻近电子设备的两个或更多个部件彼此接合的位置处或邻近处。 还公开了装配方法。

公开(公告)号：US09949377B2

公开(公告)日：2018-04-17

申请号：US14593614

申请日：2015-01-09

Applicant: HZO, INC.

Inventor： Max Sorenson ,  Blake Stevens ,  Alan Rae ,  Marc Chason

IPC: H05K1/16 ,  H05K3/28 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H05K1/185 ,  H05K13/00 ,  H05K2201/09872 ,  Y10T29/49002 ,  Y10T29/49117

Abstract: A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

公开(公告)号：US09426936B2

公开(公告)日：2016-08-23

申请号：US13736753

申请日：2013-01-08

Applicant: HZO, INC.

Inventor： Blake Stevens ,  Max Sorenson ,  Marc Chason

IPC: B23P19/00 ,  H05K13/04 ,  H05K13/00 ,  H05K3/28

CPC classification number: H05K13/0495 ,  C08G61/025 ,  C08G2261/312 ,  H05K3/28 ,  H05K3/282 ,  H05K3/341 ,  H05K13/00 ,  H05K13/0465 ,  Y10T29/49002 ,  Y10T29/49885 ,  Y10T29/53187

Abstract: A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

Abstract translation: 一种用于组装电子装置的系统包括至少一个用于在组装装置的表面上施加耐湿涂层或组装电子装置的涂层元件。 随着组件和一个或多个防潮涂层被加入到组装的电子器件中以形成成品电子器件，涂层所在的至少一个表面，因此涂层本身的至少一部分位于内部 在完成的电子设备内。 还公开了用于组装包括内部限制的防潮涂层的电子装置的方法。