公开(公告)号：US20240107658A1

公开(公告)日：2024-03-28

申请号：US18511466

申请日：2023-11-16

Applicant: Solid-tech Co., Ltd.

Inventor： Tzu Chien HUNG ,  Chun-Teng KO ,  Bomin TU ,  Zhengyu LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/38

CPC classification number: H05K1/0209 ,  H05K1/0212 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/09872 ,  H05K2203/0522

Abstract: This invention provides a carrier or submount for high power devices packaging and a method for forming the carrier or submount. The carrier comprises a thermal conductive ceramic substrate, a patterned adhesion layer on the substrate, a heat dissipation layer on the patterned adhesion layer, a conformal cover layer enclosing the heat dissipation layer and the adhesion layer, a diffusion barrier layer on the conformal cover layer, an eutectic bonding layer on the diffusion barrier layer, and a dissipation ceramic substrate with an L-shape bonding conductor, wherein one end of the L-shape bonding conductor bonds to the power device and the other end bonds to the conformal cover layer at the second region. The substrate includes a first region for bonding high power device, a second region for wire-bonding, and a third region for heat sink. The first region and second region are on a first surface of the substrate, and the third region is one the second surface, opposite to the first surface, of the substrate.

公开(公告)号：US10064282B2

公开(公告)日：2018-08-28

申请号：US15158645

申请日：2016-05-19

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen

IPC: H01L23/00 ,  H05K1/18 ,  H05K1/02 ,  H01L33/52 ,  H01L23/498 ,  H01L23/538 ,  H01L51/00

CPC classification number: H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

公开(公告)号：US10064266B2

公开(公告)日：2018-08-28

申请号：US13185583

申请日：2011-07-19

Applicant: Kevin J. Fitzpatrick ,  Ryan K. Roth

Inventor： Kevin J. Fitzpatrick ,  Ryan K. Roth

IPC: H01H85/04 ,  H05K1/02 ,  H01H85/46 ,  A47L15/46 ,  H01R12/70

CPC classification number: H05K1/0256 ,  A47L15/46 ,  H01H85/04 ,  H01H85/463 ,  H01R12/7088 ,  H05K1/0263 ,  H05K2201/012 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09872 ,  H05K2201/10181 ,  H05K2201/10189

Abstract: A printed circuit board to which corresponding wiring connectors such as power wiring connectors, may be connected to couple electrical components and a power supply to the printed circuit board and a control housing, which may be used for operably storing such a printed circuit board.

公开(公告)号：US10057983B1

公开(公告)日：2018-08-21

申请号：US14304650

申请日：2014-06-13

Applicant: Verily Life Sciences LLC

Inventor： James Etzkorn ,  Harvey Ho

IPC: H05K3/32 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0298 ,  A61B5/00 ,  A61B5/14532 ,  A61B5/1486 ,  A61B5/6821 ,  G02B3/00 ,  H05K3/007 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4682 ,  H05K2201/09872 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/20 ,  H05K2203/0384 ,  H05K2203/0756 ,  H05K2203/1322 ,  H05K2203/1377

Abstract: A method may involve: forming a first bio-compatible layer; forming an etch stop over a portion of the first bio-compatible layer; forming a conductive pattern over the etch stop and the first bio-compatible layer, wherein the conductive pattern defines an antenna, sensor electrodes, electrical contacts, and one or more electrical interconnects; mounting an electronic component to the electrical contacts; forming a second bio-compatible layer over the electronic component, the antenna, the sensor electrodes, the electrical contacts, the one or more electrical interconnects, and the etch stop; and etching, using an etchant, a portion of the second bio-compatible layer to form an opening in the second bio-compatible layer and thereby expose the sensor electrodes, wherein the etch stop inhibits etching of the portion of the first bio-compatible layer by the etchant.

公开(公告)号：US09832902B2

公开(公告)日：2017-11-28

申请号：US14556116

申请日：2014-11-29

Applicant: ELANTAS PDG, INC.

Inventor： Richard David Jordan, Jr. ,  Thomas C. Scanlon, IV

IPC: C08G18/24 ,  C08G18/48 ,  C08G18/76 ,  C08G18/80 ,  C08G59/00 ,  C08G59/18 ,  C08G77/04 ,  C08L33/08 ,  C08L33/10 ,  C09D133/08 ,  C09D133/10 ,  C09D175/04 ,  C09D183/04 ,  H05K3/28 ,  H05K7/14

CPC classification number: H05K7/1427 ,  C08G18/246 ,  C08G18/4825 ,  C08G18/7664 ,  C08G18/8067 ,  C08G59/00 ,  C08G59/184 ,  C08G77/04 ,  C08L33/08 ,  C08L33/10 ,  C09D133/08 ,  C09D133/10 ,  C09D175/04 ,  C09D183/04 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/09872 ,  C08G18/10 ,  C08G18/36

Abstract: Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

公开(公告)号：US09769920B2

公开(公告)日：2017-09-19

申请号：US14226593

申请日：2014-03-26

Applicant: Apple Inc.

Inventor： Colin M. Ely ,  Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf ,  Stephen Brian Lynch

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/28 ,  H05K3/00

CPC classification number: H05K1/0281 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0305 ,  H05K2201/055 ,  H05K2201/057 ,  H05K2201/09109 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10128 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1194 ,  H05K2203/1327 ,  H05K2203/1366

Abstract: An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

公开(公告)号：US09668354B2

公开(公告)日：2017-05-30

申请号：US14807594

申请日：2015-07-23

Applicant: International Business Machines Corporation

Inventor： Sarah K. Czaplewski ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: B29C65/52 ,  B32B37/14 ,  B32B37/26 ,  B32B38/10 ,  B32B43/00 ,  H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/28 ,  C09D163/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/0058 ,  H05K3/0079 ,  H05K3/282 ,  H05K3/284 ,  H05K3/288 ,  H05K3/4644 ,  H05K2201/0183 ,  H05K2201/09872 ,  H05K2203/1322

Abstract: In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.

公开(公告)号：US09635759B2

公开(公告)日：2017-04-25

申请号：US14292829

申请日：2014-05-31

Applicant: Sridharan Venk ,  Earl Alfred Picard, Jr. ,  Qi Dai ,  Richard Garner

Inventor： Sridharan Venk ,  Earl Alfred Picard, Jr. ,  Qi Dai ,  Richard Garner

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/02 ,  H01L23/00 ,  F21S4/22 ,  F21V21/005 ,  H01L33/38 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H05K3/28 ,  H01L33/62 ,  G06K19/077 ,  H01L33/44

CPC classification number: H05K1/111 ,  F21S4/22 ,  F21V21/005 ,  G06K19/07749 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1421 ,  H05K1/0209 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/051 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09872 ,  H05K2201/099 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1545 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.

公开(公告)号：US20170094810A1

公开(公告)日：2017-03-30

申请号：US15266624

申请日：2016-09-15

Applicant: Semblant Limited

Inventor： Gianfranco Aresta ,  Gareth Hennighan ,  Andrew Simon Hall Brooks ,  Shailendra Vikram Singh

IPC: H05K3/46 ,  C23C16/505 ,  H05K1/18

CPC classification number: H05K3/467 ,  C23C16/30 ,  C23C16/505 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/0104 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2203/095 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338

Abstract: An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

公开(公告)号：US20170055374A1

公开(公告)日：2017-02-23

申请号：US14831464

申请日：2015-08-20

Applicant: Microsoft Technology Licensing, LLC

Inventor： Juha Erkki Antero Penttinen

IPC: H05K7/20 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K7/20436 ,  G06F1/203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0162 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1316

Abstract: In an embodiment, thermal conductive material within a device having electrical component is described. In an embodiment, a device is disclosed comprising: a printed circuit board comprising electrical components; a housing of the device, wherein the housing substantially encloses the printed circuit board; a thermal conductive material coated on the printed circuit board, wherein the thermal conductive material is configured to coat an interface between an electrical component and the printed circuit board, and wherein the thermal conductive material is located between the printed circuit board and a portion of the housing according to both a three dimensional topography of the printed circuit board and a three dimensional shape of the portion of the housing.

Abstract translation: 在一个实施例中，描述了具有电气部件的装置内的导热材料。 在一个实施例中，公开了一种装置，包括：包括电气部件的印刷电路板; 所述装置的壳体，其中所述壳体基本上包围所述印刷电路板; 涂覆在所述印刷电路板上的导热材料，其中所述导热材料被配置为涂覆电气部件和所述印刷电路板之间的界面，并且其中所述导热材料位于所述印刷电路板和所述印刷电路板的一部分之间 根据印刷电路板的三维形状以及壳体的一部分的三维形状的外壳。