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公开(公告)号：US20250087955A1
公开(公告)日：2025-03-13
申请号：US18367419
申请日：2023-09-12
Applicant: Hamilton Sundstrand Corporation
Inventor： Catherine Canciamille , Kevin Kilroy
Abstract: In accordance with at least one aspect of this disclosure, a system includes, an alignment comb configured to prevent rotation of a contact pin of a connector relative to the connector. In embodiments, the alignment comb can be of a non-electrically conductive material. In embodiments, the alignment comb includes, a planar portion extending along a longitudinal axis between a first end and a second end, an aperture defined in the planar portion, and a slot defined at least partially within the planar portion. Embodiments of the slots within the alignment comb allow the comb to slide along the first and second respective contact pins such that the alignment comb can be lifted to allow for application of a conformal coating on the contact pins and/or to allow soldering the contact pins to a printed wiring board.
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公开(公告)号：US12082334B2
公开(公告)日：2024-09-03
申请号：US17720685
申请日：2022-04-14
Applicant: Hamilton Sundstrand Corporation
Inventor： John Dickey , Kevin Kilroy
CPC classification number: H05K1/0207 , H05K1/021 , H05K1/09 , H05K1/181 , H05K3/107 , H05K2201/0302 , H05K2201/032 , H05K2201/10166
Abstract: Circuit board assemblies include a circuit board portion having a recess formed therein, an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion, an electrically and thermally conductive layer adapted and configured to interface with an external chassis, and a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.
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3.发明公开公开(公告)号：US20230337353A1
公开(公告)日：2023-10-19
申请号：US17720685
申请日：2022-04-14
Applicant: Hamilton Sundstrand Corporation
Inventor： John Dickey , Kevin Kilroy
CPC classification number: H05K1/0207 , H05K1/021 , H05K1/09 , H05K1/181 , H05K3/107 , H05K2201/0302 , H05K2201/032 , H05K2201/10166
Abstract: Circuit board assemblies include a circuit board portion having a recess formed therein, an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion, an electrically and thermally conductive layer adapted and configured to interface with an external chassis, and a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.
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