公开(公告)号：US20160247976A1

公开(公告)日：2016-08-25

申请号：US15027637

申请日：2014-10-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut RUDMANN ,  Susanne WESTENHÖFER ,  Simon GUBSER

IPC: H01L33/48 ,  H01S5/02 ,  H01L27/146 ,  H01S5/183 ,  H01L33/58 ,  H01L33/60

CPC classification number: H01L33/483 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L33/60 ,  H01L51/5225 ,  H01L51/5275 ,  H01L2251/566 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01S5/02 ,  H01S5/183 ,  H01L2924/00

Abstract: An optoelectronic module includes a cover substrate including a passive optical element, a base substrate including an optoelectronic device, and a spacer layer joining the cover substrate to the base substrate. The spacer layer includes multiple first spacer elements fixed to a surface of the cover substrate and multiple second spacer elements fixed to a surface of the base substrate, in which each first spacer element is joined to a corresponding second spacer element through an adhesive layer, and in which the cover substrate, base substrate, and spacer layer define an interior region of the module in which the optical element is aligned with the optoelectronic device.

Abstract translation: 光电子模块包括包括无源光学元件的覆盖基板，包括光电子器件的基底基板和将覆盖基板连接到基底基板的间隔层。 间隔层包括固定到覆盖基板的表面的多个第一间隔元件和固定到基底表面的多个第二间隔元件，其中每个第一间隔元件通过粘合剂层与相应的第二间隔元件接合，以及 其中所述盖基板，基底基板和间隔层限定所述模块的内部区域，其中所述光学元件与所述光电子器件对准。

公开(公告)号：US20160112808A1

公开(公告)日：2016-04-21

申请号：US14894059

申请日：2014-05-26

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Jens GEIGER ,  Markus ROSSI ,  Hartmut RUDMANN

IPC: H04R19/04 ,  B81C1/00 ,  H04R19/00 ,  H04R3/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00873 ,  H04R3/00 ,  H04R19/005 ,  H04R31/00

Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.

Abstract translation: 通过提供第一衬底晶片62来制造多个MEMS麦克风模块的方法，第一衬底晶片62上安装有包括LED 102，IC芯片22和MEM麦克风装置24的多个组，其中LED 102和IC芯片22是 由第一间隔件104,64A，64包围和隔开，间隔件104高得多，将第二衬底附接在IC芯片22上方的第一间隔件的顶部上，将MEMS麦克风装置24安装到第二衬底60上，第二衬底 衬底不延伸穿过LED102，通过第二间隔件32A，32围绕MEMS麦克风装置，将覆盖晶片28的整个第一衬底晶片62覆盖所有多个组，将开口30形成到MEMS空腔，将衬底 晶片62通过分离间隔物104,32,64的宽度分成单独的MEMS麦克风模块。导电迹线可延伸穿过间隔物。 还定义了没有LED的MEMS模块，不在单个衬底上或在单个衬底的任一侧上堆叠。

公开(公告)号：US20170336543A1

公开(公告)日：2017-11-23

申请号：US15522423

申请日：2015-11-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Nicola SPRING ,  Hartmut RUDMANN ,  Markus ROSSI

IPC: G02B5/04 ,  F21V7/00 ,  G02B17/08

CPC classification number: G02B5/045 ,  F21V7/0091 ,  G02B3/0062 ,  G02B5/04 ,  G02B6/13 ,  G02B6/43 ,  G02B13/0065 ,  G02B17/0856

Abstract: The method for manufacturing optical light guide elements comprises a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement. The method further comprises at least one of the following steps d), d′), d″): d) segmenting the bar arrangement into bars referred to as prism bars each of which comprises a portion of at least two different ones of the plurality of initial bars, by conducting a plurality of cuts through the bar arrangement; in particular wherein the cuts are parallel cuts; d′) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into parts along cut lines, wherein the cut lines are at an angle with the initial-bar directions; d″) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into sections by creating cut faces which are at an angle with respect to the initial-bar directions. And the method further comprises e) segmenting the prism bars into parts.