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公开(公告)号：US20220405905A1
公开(公告)日：2022-12-22
申请号：US17840798
申请日：2022-06-15
Applicant: Hitachi High-Tech Corporation
Inventor： Yuki Doi , Naoaki Kondo , Minoru Harada , Hideki Nakayama , Yohei Minekawa , Yuji Takagi
Abstract: In learning processing performed before sample observation processing (steps S705 to S708), the sample observation device acquires a low-picture quality learning image under a first imaging condition for each defect position indicated by defect position information, determines an imaging count of a plurality of high-picture quality learning images associated with the low-picture quality learning image for each defect position and a plurality of imaging points based on a set value of the imaging count, acquires the plurality of high-picture quality learning images under a second imaging condition (step S702), learns a high-picture quality image estimation model using the low-picture quality learning image and the plurality of high-picture quality learning images (step S703), and adjusts a parameter related to the defect detection in the sample observation processing using the high-picture quality image estimation model (step S704).
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公开(公告)号：US12260545B2
公开(公告)日：2025-03-25
申请号：US17840798
申请日：2022-06-15
Applicant: Hitachi High-Tech Corporation
Inventor： Yuki Doi , Naoaki Kondo , Minoru Harada , Hideki Nakayama , Yohei Minekawa , Yuji Takagi
Abstract: In learning processing performed before sample observation processing (steps S705 to S708), the sample observation device acquires a low-picture quality learning image under a first imaging condition for each defect position indicated by defect position information, determines an imaging count of a plurality of high-picture quality learning images associated with the low-picture quality learning image for each defect position and a plurality of imaging points based on a set value of the imaging count, acquires the plurality of high-picture quality learning images under a second imaging condition (step S702), learns a high-picture quality image estimation model using the low-picture quality learning image and the plurality of high-picture quality learning images (step S703), and adjusts a parameter related to the defect detection in the sample observation processing using the high-picture quality image estimation model (step S704).
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公开(公告)号：US12210338B2
公开(公告)日：2025-01-28
申请号：US17456228
申请日：2021-11-23
Applicant: Hitachi High-Tech Corporation
Inventor： Kosuke Matsumoto , Satoshi Takada , Hideki Nakayama , Miyuki Fukuda , Kozo Miyake , Yuya Isomae
IPC: G05B19/418 , G06T7/00
Abstract: As a technology for an observation device and an inspection device, a technology capable of reducing a work effort related to generation of a recipe including alignment information is provided. An observation device 1 includes an observation unit 103 that obtains an image for observing a sample 101 on a stage 102. A computer system 2 of the observation device 1 acquires the image from the observation unit 103, specifies a period of a pattern-formed unit region repeatedly formed on a surface of the sample 101 from the image, and generates a recipe including observation or inspection alignment positions of the sample 101 using the specified period.
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公开(公告)号：US20220187810A1
公开(公告)日：2022-06-16
申请号：US17456228
申请日：2021-11-23
Applicant: Hitachi High-Tech Corporation
Inventor： Kosuke MATSUMOTO , Satoshi Takada , Hideki Nakayama , Miyuki Fukuda , Kozo Miyake , Yuya Isomae
IPC: G05B19/418 , G06T7/00
Abstract: As a technology for an observation device and an inspection device, a technology capable of reducing a work effort related to generation of a recipe including alignment information is provided. An observation device 1 includes an observation unit 103 that obtains an image for observing a sample 101 on a stage 102. A computer system 2 of the observation device 1 acquires the image from the observation unit 103, specifies a period of a pattern-formed unit region repeatedly formed on a surface of the sample 101 from the image, and generates a recipe including observation or inspection alignment positions of the sample 101 using the specified period.
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