公开(公告)号：US20230402248A1

公开(公告)日：2023-12-14

申请号：US18034929

申请日：2020-12-16

Applicant: Hitachi High-Tech Corporation

Inventor： Akito TANOKUCHI ,  Hiroki TSUBOUCHI ,  Takao UBUKATA

IPC: H01J37/18 ,  H01J37/28

CPC classification number: H01J37/18 ,  H01J37/28 ,  H01J2237/1825

Abstract: Provided are a vacuum treatment device and a vacuum treatment method with which it is possible to suppress deterioration of the degree of vacuum in a conveyance destination vacuum chamber when conveying a sample between two vacuum chambers. In this regard, a control device 30 controls conveyance of a wafer 600 from LC 102 to SC 101 via a LC-SC gate valve 510. At this time, the control device stops vacuum evacuation, which is being performed by a TMP 401A for a first duration of time, after having controlled the LC-SC gate valve 510 to close, measures an internal pressure of the LC 102 by using a pressure gauge 103 in a condition in which the vacuum evacuation is stopped, and controls the LC-SC gate valve 510 to open if the measured internal pressure has reached a first reference value.

公开(公告)号：US20250054724A1

公开(公告)日：2025-02-13

申请号：US18723514

申请日：2022-02-18

Applicant: Hitachi High-Tech Corporation

Inventor： Akito TANOKUCHI ,  Hiroki TSUBOUCHI ,  Hiroyuki ANDOU ,  Takao UBUKATA

IPC: H01J37/18 ,  H01J37/20 ,  H01J37/285

Abstract: The purpose of the present disclosure is to provide a vacuum processing device that switches the rate of pressure variation depending on, e.g., the type of an object to be inspected, thereby making it possible to ensure operation reliability during inspection of a fragile object to be inspected, while preventing a decrease in throughput. The vacuum processing device according to the present disclosure comprises a preliminary exhaust chamber for the transfer of a sample between a sample chamber and the external air. The conductance of a pipe for ventilating the preliminary exhaust chamber is varied in accordance with a parameter corresponding to the fragility of a shape pattern formed on the sample (see FIG. 5).