公开(公告)号：US4257061A

公开(公告)日：1981-03-17

申请号：US842972

申请日：1977-10-17

Applicant: Roy W. Chapel, Jr. ,  I. Macit Gurol

Inventor： Roy W. Chapel, Jr. ,  I. Macit Gurol

IPC: G01R19/03 ,  H01L21/60 ,  H01L21/76 ,  H01L21/762 ,  H01L21/764 ,  H01L23/14 ,  H01L23/482 ,  H01L23/495 ,  H01L23/498 ,  H01L27/02 ,  H01L23/48

CPC classification number: H01L24/85 ,  G01R19/03 ,  H01L21/76264 ,  H01L21/764 ,  H01L23/147 ,  H01L23/4822 ,  H01L23/495 ,  H01L23/498 ,  H01L21/76289 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0211 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043

Abstract: A process for producing thermally isolated monolithic semiconductor die and die produced by the process, plus improved apparatus using the die are disclosed. The process generally comprises the steps of: forming a desired semiconductor component or circuit in a semiconductor wafer (preferably a silicon wafer of crystal orientation) having a protective layer (SiO.sub.2) on one surface; forming platinum silicide contact windows in said protective layer where external connections to the semiconductor component or circuit is necessary; forming support leads of a layer of adhesive material (which also may have resistive properties, such as Nichrome) and a layer of a structurally strong metal of high electrical conductivity and low thermal conductivity (preferably 304 stainless steel) along predetermined paths extending outwardly toward the edge of the die from said contact windows; simultaneously with the forming of the adhesive layer of said support leads, forming one or more thin film resistors in predetermined regions of said die atop said SiO.sub.2 protective layer, if desired; removing said SiO.sub.2 protective layer from a region defined by said support leads, an island or islands in which said semiconductor component or circuit and said resistors are formed and a surrounding frame; and, removing said silicon from the region between said island or islands and said frame. The resulting semiconductor die comprises a frame surrounding one or more islands in which semiconductor components or circuits are formed, and which support resistors, if included. The islands are entirely supported by the support leads extending between the frame and the islands. In addition to providing support, the support leads also provide for electrical connection to the semiconductor components or circuits and to the resistors. The semiconductor die may be mounted in a package that also forms part of the invention. The package includes a ceramic substrate having an aperture in its center and alignment mesas and ridges on one surface. The ceramic substrate is formed so as to be mounted on the metal header of a conventional semiconductor canister housing. Depending upon their specific nature the resulting die are useful in and/or improve a variety of electrical apparatus. They are particularly useful as the dual RMS sensor element of an RMS converter. They can also be formed so as to be useful as radiation sensors. Or, they can be formed so as to provide a thermal platform whose temperature is controlled and stabilized at a predetermined value. All of these dies and the improved circuits resulting from their use also form part of the invention.

公开(公告)号：USRE33859E

公开(公告)日：1992-03-24

申请号：US608506

申请日：1990-11-02

Applicant: I. Macit Gurol

Inventor： I. Macit Gurol

IPC: H01C17/242 ,  H01L21/70 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K1/16 ,  H05K3/28

CPC classification number: H05K3/28 ,  H01C17/242 ,  H01L21/702 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/017 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A ceramic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

公开(公告)号：US4423299A

公开(公告)日：1983-12-27

申请号：US255677

申请日：1981-04-20

Applicant: I. Macit Gurol ,  Gary M. Bang

Inventor： I. Macit Gurol ,  Gary M. Bang

IPC: H01H13/76 ,  H01H13/00 ,  H01H13/83 ,  H01H9/00 ,  H01H13/02

CPC classification number: H01H13/83

Abstract: A transparent switch array is disclosed that includes a relatively flexible or pliant sheet having a number of vertically-extending conductive column elements mounted in spaced apart parallel relationship with a relatively rigid backplate that includes a number of horizontally extending conductive row elements so that the intersecting row and column elements, in effect, form a matrix of rectangular touch-pressure activated switches. A relatively thin, flat electrical cable that is interposed between two edge regions of the backplate and the flexible sheet provides a portion of the peripheral backplate-flexible sheet spacing, with thin adhesive strips establishing the interelement spacing along the other two border regions. An array of small transparent elastomeric dots or beads that are deposited on one surface of the pliant sheet in effect outline the individual switch elements and maintain the pliant sheet in noncontacting, closely spaced orientation with the backplate. Compressive U-shaped spring clips, spaced along the periphery of the switch array, maintain the components in proper position and ensure good electrical contact between the conductive row and column elements and solderless connections between the electrical cable and the conductive elements of the backplate and the flexible sheet.

Abstract translation: 公开了一种透明开关阵列，其包括具有多个垂直延伸的导电柱元件的相对柔性或柔韧的片材，所述多个垂直延伸的导电柱元件与包括多个水平延伸的导电行元件的相对刚性的背板隔开平行的关系安装，使得相交行 而柱元件实际上形成矩形触摸压力激活开关的矩阵。 插入在背板和柔性片的两个边缘区域之间的相对薄的扁平电缆提供了外围背板 - 柔性片间隔的一部分，薄的粘合带沿着另外两个边界区域建立了间隔间隔。 沉积在柔性片材的一个表面上的小的透明弹性体点或珠粒的阵列实际上是轮廓各个开关元件，并且将柔性片材与背板保持非接触，紧密间隔的方向。 压缩的U形弹簧夹沿开关阵列的周边间隔开，将部件保持在正确的位置，并确保导电行和列元件之间良好的电接触，以及电缆与背板的导电元件之间的无焊接连接 柔性片。

公开(公告)号：US4346291A

公开(公告)日：1982-08-24

申请号：US182966

申请日：1980-09-02

Applicant: Roy W. Chapel, Jr. ,  I. Macit Gurol

Inventor： Roy W. Chapel, Jr. ,  I. Macit Gurol

IPC: G01R19/03 ,  H01L21/60 ,  H01L21/762 ,  H01L21/764 ,  H01L23/14 ,  H01L23/482 ,  H01L23/495 ,  H01L23/498 ,  H01L27/02 ,  G06G7/20

CPC classification number: G01R19/03 ,  H01L21/76264 ,  H01L21/764 ,  H01L23/147 ,  H01L23/4822 ,  H01L23/495 ,  H01L23/498 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L21/76289 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/75 ,  H01L2224/85 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0211 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/19043

Abstract: A process for producing thermally isolated semiconductor die and die produced by the process, plus improved apparatus using the die are disclosed. The process generally comprises the steps of: forming a desired semiconductor component or circuit in a semiconductor wafer (preferably a silicon wafer of crystal orientation) having a protective layer (SiO.sub.2) on one surface; forming platinum silicide contact windows in said protective layer where external connections to the semiconductor component or circuit is necessary; forming support leads of a layer of adhesive material (which also may have resistive properties, such as Nichrome) and a layer of a structurally strong metal of high electrical conductivity and low thermal conductivity (preferably 304 stainless steel) along predetermined paths extending outwardly toward the edge of the die from said contact windows; simultaneously with the forming of the adhesive layer of said support leads, forming one or more thin film resistors in predetermined regions of said die atop said SiO.sub.2 protective layer, if desired; removing said SiO.sub.2 protective layer from a region defined by said support leads, an island or islands in which said semiconductor component or circuit and said resistors are formed and a surrounding frame; and, removing said silicon from the region between said island or islands and said frame. The resulting semiconductor die comprises a frame surrounding one or more islands in which semiconductor components or circuits are formed, and which support resistors, if included. The islands are entirely supported by the support leads extending between the frame and the islands. In addition to providing support, the support leads also provide for electrical connection to the semiconductor components or circuits and to the resistors. The semiconductor die may be mounted in a package that also forms part of the invention. The package includes a ceramic substrate having an aperture in its center and alignment mesas and ridges on one surface. The ceramic substrate is formed so as to be mounted on the metal header of a conventional semiconductor canister housing. Depending upon their specific nature the resulting die are useful in and/or improve a variety of electrical apparatus. They are particularly useful as the dual RMS sensor element of an RMS converter. They can also be formed so as to be useful as radiation sensors. Or, they can be formed so as to provide a thermal platform whose temperature is controlled and stabilized at a predetermined value. All of these dies and the improved circuits resulting from their use also form part of the invention.

公开(公告)号：US6143221A

公开(公告)日：2000-11-07

申请号：US267192

申请日：1999-03-12

Applicant: I. Macit Gurol

Inventor： I. Macit Gurol

IPC: B02C13/18 ,  B02C13/28 ,  B02C13/284 ,  B02C18/18 ,  B02C23/16 ,  B02C23/24 ,  B29B9/00 ,  B29B13/06 ,  F26B17/10

CPC classification number: B02C13/2804 ,  B02C13/18 ,  B02C13/284 ,  B02C18/18 ,  B02C23/24 ,  B29B13/065 ,  B29B9/00 ,  F26B17/105 ,  B02C2023/165

Abstract: Apparatus for agglomerating and drying particulate material, including an agglomerator (4) for forming and discharging wet granules of a predetermined size or smaller, and a dryer (12). The agglomerator utilizes a rotary blade assembly (100) that repeatedly impacts and cuts the wet mixture of material to be agglomerated, which is forced radially outward through the blade assembly under centrifugal and air pressure force. Wet granules pass through an annular screen (104) where they reach a predetermined maximum size. The dryer has an inlet (50) for wet granules from the agglomerator, an outlet (78) for granules having passed through the dryer, and one or more baffles (64) within the dryer defining a spiral path through which the granules pass from the dryer inlet towards the dryer outlet. The baffles are configured such that their pitch increases with distance from the dryer inlet, whereby the cross-sectional area of the spiral path increases toward the dryer outlet.

Abstract translation: 用于聚集和干燥颗粒材料的装置，包括用于形成和排出预定尺寸或更小尺寸的湿颗粒的凝结器（4）和干燥器（12）。 附聚器利用旋转刀片组件（100），该旋转刀片组件（100）重复地冲击和切割要凝聚的材料的湿混合物，其在离心和空气压力作用下被径向向外穿过叶片组件。 湿颗粒通过环形筛（104），在那里它们达到预定的最大尺寸。 干燥器具有用于来自附聚器的湿颗粒的入口（50），用于通过干燥器的颗粒的出口（78）和干燥器内的一个或多个挡板（64），其限定了颗粒从其中通过的螺旋路径 干燥器入口朝向干燥器出口。 挡板被构造成使得它们的间距随着距离干燥器入口的距离而增加，由此螺旋路径的横截面积朝向干燥器出口增加。

公开(公告)号：US4906311A

公开(公告)日：1990-03-06

申请号：US172014

申请日：1988-03-23

Applicant: I. Macit Gurol

Inventor： I. Macit Gurol

IPC: H01C13/02 ,  H01C17/242 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01C13/02 ,  H01C17/242 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/017 ,  Y10T156/1089 ,  Y10T156/1093

Abstract: A cermic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

Abstract translation: 皮质基材支持由玻璃密封玻璃密封玻璃密封在陶瓷基片上的玻璃玻璃覆盖物密封的薄膜电子电路。 将玻璃状密封玻璃在包含粘合剂材料和液化器的组合物中筛选到玻璃状玻璃覆盖物上。 电子电路在完成了倾向于影响电阻元件的电阻率的那些工艺步骤之后，通过引导通过玻璃玻璃覆盖物的激光束被修整为最终工艺步骤之一; 工艺步骤如组件的高温烘烤和焊接。

公开(公告)号：US4725480A

公开(公告)日：1988-02-16

申请号：US779643

申请日：1985-09-24

Applicant: I. Macit Gurol

Inventor： I. Macit Gurol

IPC: H01L23/02 ,  H01C13/02 ,  H01C17/242 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K1/16 ,  B32B3/00 ,  B32B9/00

CPC classification number: H01L23/3121 ,  H01C13/02 ,  H01C17/242 ,  H01L23/295 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/017 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A ceramic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

Abstract translation: 陶瓷基板通过热熔玻璃密封玻璃支撑由密封在陶瓷基片上的玻璃玻璃覆盖物密封地封闭的薄膜或厚膜电子电路。 将玻璃状密封玻璃在包含粘合剂材料和液化器的组合物中筛选到玻璃状玻璃覆盖物上。 电子电路在完成了倾向于影响电阻元件的电阻率的那些工艺步骤之后，通过引导通过玻璃玻璃覆盖物的激光束被修整为最终工艺步骤之一; 工艺步骤如组件的高温烘烤和焊接。