-
公开(公告)号：US12076971B2
公开(公告)日：2024-09-03
申请号：US17041884
申请日：2019-03-27
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Dean Michael Thelen
IPC: B32B7/027 , B32B17/06 , C03C3/087 , C03C3/091 , C03C3/093 , C03C4/18 , C03C10/00 , C03C21/00 , H05K1/02 , H05K1/03
CPC classification number: B32B7/027 , B32B17/06 , C03C3/087 , C03C3/091 , C03C3/093 , C03C4/18 , C03C10/0009 , C03C10/0054 , H05K1/024 , H05K1/0306 , B32B2307/30 , B32B2307/732 , B32B2457/00 , C03C21/002 , C03C2204/00 , H05K2201/017 , H05K2201/0191 , H05K2201/068
Abstract: A laminated glass structure for an electronic device includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad glass layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to about 100 GHz.
-
2.发明授权公开(公告)号：US11690402B2
公开(公告)日：2023-07-04
申请号：US16868256
申请日：2020-05-06
Applicant: JAPAN TOBACCO INC.
Inventor： Tetsuya Yoshimura , Masato Miyauchi
IPC: A24F40/46 , A24B15/167 , A24F40/57 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/12 , A24F40/50 , B82Y30/00 , A24F40/10 , A24F40/20
CPC classification number: A24F40/46 , A24B15/167 , A24F40/50 , A24F40/57 , H05K1/0298 , H05K1/0306 , H05K1/0386 , H05K1/092 , H05K3/1283 , A24F40/10 , A24F40/20 , B82Y30/00 , H05K2201/017 , H05K2201/0154 , H05K2201/0284 , H05K2201/0293
Abstract: A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290° C. is less than 20% of a percentage weight loss of the paper from room temperature to 900° C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10° C./min.
-
公开(公告)号：US11647581B2
公开(公告)日：2023-05-09
申请号：US16903694
申请日：2020-06-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuki Takemori
IPC: H05K1/11 , H05K1/03 , H05K3/28 , B32B3/26 , B32B15/04 , B32B3/30 , B32B9/00 , B32B9/04 , H05K1/02 , H05K3/34 , H05K3/46 , H05K3/24
CPC classification number: H05K1/0306 , B32B3/263 , B32B3/266 , B32B3/30 , B32B9/005 , B32B9/043 , B32B15/04 , H05K1/0271 , H05K1/113 , H05K3/285 , H05K3/34 , H05K3/4644 , H05K3/244 , H05K2201/017 , H05K2201/0195 , H05K2201/0347 , H05K2201/099 , H05K2201/0969 , H05K2201/09145 , H05K2201/09436 , H05K2201/09481 , H05K2201/09727 , H05K2201/09736 , H05K2201/09745 , H05K2203/1131 , Y10T428/12201 , Y10T428/12361 , Y10T428/24273 , Y10T428/24331
Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.
-
4.发明申请公开(公告)号：US20180302982A1
公开(公告)日：2018-10-18
申请号：US15951808
申请日：2018-04-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Sumiyo Nakamura , Takahiro Sumi , Takahiro Oka
IPC: H05K1/03 , C04B35/626 , C04B35/622 , C04B35/20 , C04B35/195 , H05K1/02 , H05K3/12 , H05K1/11
CPC classification number: H05K1/0306 , C04B35/195 , C04B35/20 , C04B35/62218 , C04B35/62625 , C04B2235/3215 , C04B2235/3217 , C04B2235/3481 , C04B2235/36 , C04B2235/80 , H01L21/4867 , H01L23/12 , H01L23/15 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K1/0298 , H05K1/111 , H05K1/115 , H05K3/1291 , H05K3/4629 , H05K2201/017 , H05K2201/0209 , H05K2201/068 , H05K2201/09563 , H05K2201/099 , H05K2201/09909 , Y02P70/611 , H01L2924/00
Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
-
公开(公告)号：US20180035537A1
公开(公告)日：2018-02-01
申请号：US15543264
申请日：2016-01-08
Applicant: NGK SPARK PLUG CO., LTD.
Inventor： Tatsuya KATOH , Masanori ITO , Masaki KUTSUNA
CPC classification number: H05K3/40 , B32B9/005 , B32B2307/202 , C03C4/14 , C03C10/0054 , C03C2204/00 , C04B35/6303 , C04B2237/40 , C04B2237/704 , H01L23/15 , H05K1/0296 , H05K1/0306 , H05K1/09 , H05K1/092 , H05K3/12 , H05K3/1291 , H05K3/28 , H05K3/285 , H05K3/321 , H05K3/4061 , H05K3/46 , H05K3/4629 , H05K3/4664 , H05K2201/017 , H05K2201/0769 , H05K2203/1126 , Y10T29/49163
Abstract: A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.
-
Patent Agency Ranking
公开(公告)号：US09591748B2
公开(公告)日：2017-03-07
申请号：US14560485
申请日：2014-12-04
Applicant: INNOLUX CORPORATION
Inventor： Kai Meng , Lien-Hsin Lee
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
-
公开(公告)号：US20170034920A1
公开(公告)日：2017-02-02
申请号：US15039949
申请日：2014-11-28
Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA
Inventor： Kosuke TSUJI , Kazunori KOIKE , Katsura KAWASHIMA , Kenju TSUCHIYA , Shinji IMAI
CPC classification number: H05K3/067 , C23F1/20 , H05K1/0306 , H05K1/032 , H05K1/092 , H05K3/061 , H05K3/381 , H05K2201/017 , H05K2203/0384 , H05K2203/0502
Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.
Abstract translation: 本发明涉及一种制造电路板的方法，包括以下步骤：至少在表面上制备含有硅的衬底，将含有铝颗粒的糊料施加到衬底上，通过烧制衬底在基底上形成导体层， 已经施加了糊剂，在导体层上形成具有特定图案的抗蚀剂膜，并且用蚀刻剂除去未形成抗蚀剂膜的部分中的导体层，含有氟化物离子的蚀刻剂和金属离子的蚀刻剂 标准电极电位的值比铝的标准电极电位高的金属M，以及可以用这种方法制造的电路板。
-
8.发明申请METHOD OF MANUFACTURING CHIP-ON-BOARD AND SURFACE MOUNT DEVICE LED SUBSTRATE 审中-公开制造芯片板和表面安装器件LED基板的方法公开(公告)号：US20160172548A1
公开(公告)日：2016-06-16
申请号：US14565798
申请日：2014-12-10
Applicant: Baskaran A/L Govinda Nair , MILLENNIUM SUBSTRATES SDN BHD
Inventor： R. Remakantan A/L Ramachandran , Vivegananthan Rajangam
CPC classification number: H01L21/4867 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H05K1/0206 , H05K1/021 , H05K1/053 , H05K2201/017 , H05K2201/10106 , H05K2203/1126 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00014
Abstract: A method of manufacturing Chip-On-Board LED substrate (100) and Surface Mount Device LED substrate (108) is provided, characterized in that, the Chip-On-Board LED substrate (100) and Surface Mount Device LED substrate (108) includes a fine-patterned thick film, the method includes the steps of forming a glass based dielectric layer (103, 111) on a metal plate (101, 109), firing the glass based dielectric layer (103,111), applying a metal based conductor (104, 113) over the dielectric layer (103,111), drying the metal based conductor layer (104,113), firing the glass and metal layers (103, 104, 111,113) producing a thick film and positioning LED die (105) into pockets between circuits for Chip-on-Board application and soldering packaged LED (114) onto the circuit, wherein the method allows for consolidation of thick film and bonding to substrate (100, 108).
Abstract translation: 提供一种制造板上衬底LED衬底（100）和表面贴装器件LED衬底（108）的方法，其特征在于，片上衬底LED衬底（100）和表面贴装器件LED衬底（108） 包括精细图案的厚膜，该方法包括以下步骤：在金属板（101,109）上形成玻璃基电介质层（103,111），烧制玻璃基电介质层（103,111），施加金属基导体 （104,113），在所述电介质层（103,111）之上，干燥所述金属基导体层（104,113），烧制产生厚膜的所述玻璃和金属层（103,104,111,113），并将LED管芯（105）定位在 电路板芯片应用和焊接封装的LED（114）到电路上，其中该方法允许厚膜的固结和结合到基板（100,108）。
-
公开(公告)号：US09277644B2
公开(公告)日：2016-03-01
申请号：US14246788
申请日：2014-04-07
Applicant: INNOLUX CORPORATION
Inventor： Kai Meng , Lien-Hsin Lee
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
-
公开(公告)号：US09204539B2
公开(公告)日：2015-12-01
申请号：US14560567
申请日：2014-12-04
Applicant: INNOLUX CORPORATION
Inventor： Kai Meng , Lien-Hsin Lee
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
-
-
-
-
-
-
-
-
-
Search Results
195
records
(took 0.019 seconds)
