公开(公告)号：US20220248531A1

公开(公告)日：2022-08-04

申请号：US17588414

申请日：2022-01-31

Applicant: IBIDEN CO., LTD.

Inventor： Takema ADACHI ,  Daisuke MINOURA

IPC: H05K1/11 ,  H05K3/38 ,  H05K1/09

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor, and a coating film. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is formed in contact with the connection conductor and that the wiring pattern is covered by the coating film, the conductor pad has a surface facing the second insulating layer and having first surface roughness higher than surface roughness of a surface of the wiring pattern, and the coating film has opening exposing a portion of the surface of the conductor pad from the coating film and having area larger than area of interface between the conductor pad and the connection conductor and that the connection conductor is formed on the portion of the surface of the conductor pad and is separated from the coating film.

公开(公告)号：US20220077046A1

公开(公告)日：2022-03-10

申请号：US17446186

申请日：2021-08-27

Applicant: IBIDEN CO., LTD.

Inventor： Takema ADACHI ,  Daisuke MINOURA

IPC: H01L23/498 ,  H01L21/48

Abstract: A wiring substrate includes a first conductor layer, an insulating layer on the first layer such that the insulating layer is covering the first layer, a second conductor layer on the insulating layer such that the insulating layer is formed between the first and second layers, the connection conductors penetrating through the insulating layer and connecting the first and second layers, and a coating film formed at least partially on surface of the first layer such that the film improves adhesion between the first layer and insulating layer. The first layer includes pads and wiring patterns such that the pads are in contact with the connection conductors and that the patterns have surfaces facing the insulating layer and covered by the film, and the pads have roughened surfaces facing the insulating layer and having first surface roughness that is higher than second surface roughness of the surfaces of the patterns.

公开(公告)号：US20220248533A1

公开(公告)日：2022-08-04

申请号：US17588457

申请日：2022-01-31

Applicant: IBIDEN CO., LTD.

Inventor： Takema ADACHI ,  Daisuke MINOURA

IPC: H05K1/11 ,  H05K3/26 ,  H05K3/38 ,  H05K3/42

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor penetrating through the second insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer such that the coating film is adhering the first conductor layer and the second insulating layer. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is in contact with the connection conductor and the wiring pattern is covered by the coating film, the conductor pad of the first conductor layer has a surface facing the second insulating layer and having a first surface roughness higher than a surface roughness of a surface of the wiring pattern, and the coating film has opening such that the opening is exposing the conductor pad entirely.

公开(公告)号：US20220338347A1

公开(公告)日：2022-10-20

申请号：US17708486

申请日：2022-03-30

Applicant: IBIDEN CO., LTD.

Inventor： Takema ADACHI ,  Daisuke MINOURA

IPC: H05K1/11 ,  H05K3/38

Abstract: A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.