公开(公告)号：US20160316566A1

公开(公告)日：2016-10-27

申请号：US15138792

申请日：2016-04-26

Applicant: IBIDEN CO., LTD.

Inventor： Kenji SAKAI ,  Tomoyuki IKEDA ,  Toshiki FURUTANI

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/32 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H05K1/0298 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09009 ,  H05K2201/09536 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611

Abstract: A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.

Abstract translation: 布线板包括电子部件，包括绝缘层和导电层的多层芯基板，使得绝缘层包括在芯的厚度方向的中心位置的中心绝缘层，包括绝缘层的第一累积层和 导电层，使得所述绝缘层具有与所述芯中的绝缘层的树脂组合物不同的树脂组合物，以及包括绝缘层和导电层的第二堆积层，使得所述绝缘层具有与所述绝缘层不同的树脂组合物 核心中的绝缘层。 芯具有分别容纳电子元件的空腔，并且包括第一空腔和第二空腔，使得第一和第二空腔在厚度方向上具有不同的长度，并且在第一和第二空腔的中心穿过中心层 厚度方向。