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公开(公告)号：US20230080335A1
公开(公告)日：2023-03-16
申请号：US17823210
申请日：2022-08-30
Applicant: IBIDEN CO., LTD.
Inventor： Satoru KAWAI , Katsuhiko TANNO , Susumu KAGOHASHI , Kentaro WADA
Abstract: A printed wiring board includes a resin insulating layer including resin and particles, and a conductor layer formed on a surface of the resin insulating layer. The particles in the resin insulating layer include first particles and second particles such that the first particles are partially embedded in the resin and the second particles are completely embedded in the resin, and the resin insulating layer is formed such that the first particles has exposed surfaces exposed from the resin and covered surfaces covered by the resin, respectively, the surface of the resin insulating layer includes the first exposed surfaces, and a ratio of a second area to a first area is in a range of 0.1 to 0.25 where the first area is an area of the surface of the resin insulating layer, and the second area is obtained by summing areas of the exposed surfaces of the first particles.
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Patent Agency Ranking
公开(公告)号：US20230292448A1
公开(公告)日：2023-09-14
申请号：US18182069
申请日：2023-03-10
Applicant: IBIDEN CO., LTD.
Inventor： Kentaro WADA , Koji KONDO
CPC classification number: H05K3/38 , H05K3/4688 , H05K1/112
Abstract: A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.
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公开(公告)号：US20220369456A1
公开(公告)日：2022-11-17
申请号：US17730283
申请日：2022-04-27
Applicant: IBIDEN CO., LTD.
Inventor： Tomoyuki IKEDA , Kentaro WADA
Abstract: A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer, and a coating film formed on a surface of the conductor layer such that the coating film is adhering the conductor layer and the second insulating layer. The conductor layer includes a conductor pad and a wiring pattern, and the conductor pad of the conductor layer has a mounting surface including a first region and a component mounting region formed such that the second insulating layer has a through hole exposing the component mounting region and that the first region is covered by the second insulating layer and roughened to have a surface roughness higher than a first surface roughness of a surface of the wiring pattern facing the second insulating layer.
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公开(公告)号：US20210282266A1
公开(公告)日：2021-09-09
申请号：US17184761
申请日：2021-02-25
Applicant: IBIDEN CO., LTD.
Inventor： Hiroyasu NOTO , Kentaro WADA
Abstract: A wiring substrate includes a core substrate, and a build-up part laminated on the substrate and including resin insulating layers. The insulating layers include a first insulating layer, the build-up part includes a conductor layer on the first insulating layer, a second insulating layer on the first insulating layer and covering the conductor layer, and a recess penetrating through the second insulating layer and exposing portion of the conductor layer such that the conductor layer includes component mounting region that places an electronic component in the recess and a conductor pad forming bottom surface of the recess, the insulating layers include inorganic filler such that all insulating layers or all insulating layers other than the first insulating layer include the inorganic filler and that inorganic filler content rate of the first insulating layer is lower than inorganic filler content rate of the insulating layers other than the first insulating layer.
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公开(公告)号：US20240349430A1
公开(公告)日：2024-10-17
申请号：US18631441
申请日：2024-04-10
Applicant: IBIDEN CO., LTD.
Inventor： Kentaro WADA , Koji KONDO , Kenji KUNIEDA , Masashi UMETSU , Yuta OKAGA
CPC classification number: H05K3/0094 , H05K1/113 , H05K3/181 , H05K2203/072 , H05K2203/0723
Abstract: A wiring substrate includes insulating layers including a first insulating layer and a second insulating layer, conductive layers including a first conductive layer including a pad and a second conductive layer, a coating film covering the first conductive layer including the pad and improving adhesion between the first conductive layer and the second insulating layer, and a via conductor formed in a through hole penetrating through the second insulating layer and the coating film on the pad and connecting the pad and the second conductive layer. The pad has a surface formed such that a root mean square roughness of the surface is in a range of 0.10 μm to 0.23 μm, and a peeling part is formed between the pad and the second insulating layer such that the peeling part is formed within 15 μm around an outer edge of the through hole on the surface of the pad.
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公开(公告)号：US20240040692A1
公开(公告)日：2024-02-01
申请号：US18358248
申请日：2023-07-25
Applicant: IBIDEN CO., LTD.
Inventor： Kentaro WADA , Koji KONDO , Kenji KUNIEDA , Masashi UMETSU , Yuta OKAGA
IPC: H05K1/02
CPC classification number: H05K1/0296
Abstract: A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer. The conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less.
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