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    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    3.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权

    公开(公告)号：US20210259106A1

    公开(公告)日：2021-08-19

    申请号：US17161737

    申请日：2021-01-29

    Applicant: IBIDEN CO., LTD.

    Inventor： Shota TACHIBANA

    IPC: H05K1/11 ,  H05K1/09 ,  H05K3/46 ,  H05K3/00 ,  H05K3/24

    Abstract: A printed wiring board includes resin insulating layers including an outermost resin insulating layer, conductor layers laminated on the resin insulating layers, a copper layer formed in the outermost insulating layer, and metal bumps formed on the copper layer such that the bumps have upper surfaces protruding from the outermost insulating layer and that each metal bump includes Ni film, Pd film and Au film. The copper layer is reduced in diameter toward upper surface side such that the copper layer has upper and bottom surfaces and each upper surface has diameter that is smaller than diameter of each bottom surface, the outermost insulating layer has cylindrical sidewalls formed such that at least part of the copper layer is not in contact with the sidewalls, and the bumps are formed such that the Ni film is filling spaces between the copper layer and the sidewalls of the outermost insulating layer.

    WIRING SUBSTRATE
    4.
    发明申请
    WIRING SUBSTRATE 有权

    公开(公告)号：US20220248530A1

    公开(公告)日：2022-08-04

    申请号：US17580141

    申请日：2022-01-20

    Applicant: IBIDEN CO., LTD.

    Inventor： Yoji MORI ,  Mamoru FUKUNAGA ,  Shota TACHIBANA

    IPC: H05K1/03 ,  H05K1/11

    Abstract: A wiring substrate having no core substrate includes a build-up layer including insulating layers and conductor layers such that the insulating layers include first, second, third and fourth insulating layers and that the conductor layers include a first conductor layer formed on the first insulating layer and a second conductor layer formed on the second insulating layer. The build-up layer has a first surface having the first insulating and first conductor layers, a second surface having the second insulating and second conductor layers, the third insulating layer formed on the first insulating layer on the opposite side of the first conductor layer, and the fourth insulating layer formed on the second insulating layer on the opposite side of the second conductor layer, and the build-up layer is formed such that the first and second insulating layers contain no core material and the third and fourth insulating layer include core material.

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210136929A1

    公开(公告)日：2021-05-06

    申请号：US17080927

    申请日：2020-10-27

    Applicant: IBIDEN CO., LTD.

    Inventor： Kazuyuki UEDA ,  Shota TACHIBANA

    IPC: H05K3/46 ,  H05K3/10 ,  H05K3/00 ,  H05K1/11

    Abstract: A wiring board includes a resin insulating layer having a component mounting surface, first connection pads formed on the component mounting surface of the resin insulating layer, second connection pads formed on the component mounting surface of the resin insulating layer such that the second connection pads are surrounding the first connection pads, and a protruding part including a metal material and formed on the component mounting surface of the resin insulating layer such that a portion of the protruding part is embedded in the resin insulating layer and that the protruding part is positioned between the first connection pads and the second connection pads and surrounding the first connection pads.

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