公开(公告)号：US20150068788A1

公开(公告)日：2015-03-12

申请号：US14485069

申请日：2014-09-12

Applicant: IBIDEN Co., Ltd.

Inventor： Tetsuo AMANO ,  Toshio Nishiwaki

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/115 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/096

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract translation: 印刷布线板包括：芯绝缘层，其包括树脂，并且具有通过芯绝缘层的通路导体，形成在芯层上并包括铜箔和镀膜的第一导电层，形成在第一层上的层间绝缘层 层，并且包括树脂，所述层间层具有穿过所述层间层的通孔导体，以及形成在所述中间层上并包括铜箔和镀膜的第二导电层。 第一层包括导电电路，核心层和层间介电常数为4.0或更低，信号传输频率为1GHz，热膨胀系数为85ppm /℃或更低，等于或低于Tg， 第一层的厚度大于第二层的箔的厚度。