公开(公告)号：US3808680A

公开(公告)日：1974-05-07

申请号：US26776172

申请日：1972-06-30

Applicant: IBM

Inventor： LAFRATE P ,  RELYEA V

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/20 ,  H05K3/12

CPC classification number: H05K3/4092 ,  H05K1/0306 ,  H05K1/0393 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/061 ,  H05K3/1275 ,  H05K2201/09754 ,  H05K2201/10303 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T29/49149 ,  Y10T29/49156

Abstract: A continuous process for fabricating a substrate for mounting of an integrated circuit thereon, in which an array of conductive patterns is formed in a copper sheet on a flexible insulator by a rotogravure printing and subtractive copper etch process. The flexible insulator sheet is then cut into individual pieces and a rigid member is mounted to the opposite side of the flexible insulator from the array of conducting patterns by means of contact pins which fasten the rigid members to the flexible insulator and are electrically connected to the conducting patterns.

Abstract translation: 一种制造用于在其上安装集成电路的基板的连续工艺，其中通过凹版印刷和减色铜蚀刻工艺在柔性绝缘体上的铜片中形成导电图案阵列。 然后将柔性绝缘片切割成单独的部件，并且刚性部件借助于将刚性部件固定到柔性绝缘体的接触销安装到柔性绝缘体的与导电图案阵列相反的一侧，并且电连接到 进行模式