公开(公告)号：US3811186A

公开(公告)日：1974-05-21

申请号：US31405672

申请日：1972-12-11

Applicant: IBM

Inventor： LARNERD J ,  MC GARIGLE D ,  SAMUELSON C

IPC: H05K3/34 ,  H01L21/60 ,  H05K3/30

CPC classification number: H01L24/81 ,  H01L2224/10165 ,  H01L2224/10175 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29012 ,  H01L2224/29035 ,  H01L2224/29036 ,  H01L2224/30051 ,  H01L2224/3015 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81002 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/381 ,  H05K3/303 ,  H05K2201/09036 ,  H05K2201/09909 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Method for aligning and supporting micro-circuit devices on substrate conductors during attachment thereto in which shaped, flexible, insulative material is placed between the devices and their respective conductors to support heat fusible terminals of the devices in alignment with mating heat-fusible conductor lands during formation of the respective fused connections. The insulative material can be of selected thickness to support the non-attached terminals either in contact or out of contact with their mating lands. When the circuit devices are held out of contact with their lands, the supporting material, being of plastic character, softens during heating to allow contact during the joining of the fusible connections and, upon cooling, returns to a thicker state to elongate the fused connections.

Abstract translation: 用于在附接到基板导体的过程中对准和支撑微电路器件的方法，其中成形的，柔性的绝缘材料放置在器件与它们各自的导体之间，以支撑器件的热熔接端子与配对的热熔融导体焊盘对准 形成相应的融合连接。 绝缘材料可以具有选定的厚度，以支持非连接端子与它们的配合接触部接触或不接触。 当电路设备与其焊盘保持不接触时，具有塑性特性的支撑材料在加热期间软化，以在熔融连接的接合期间接触，并且在冷却时返回到更厚的状态以延长熔合连接 。