公开(公告)号：US09326374B2

公开(公告)日：2016-04-26

申请号：US13967401

申请日：2013-08-15

Applicant: ICHIA TECHNOLOGIES,INC.

Inventor： Chien-Hwa Chiu ,  Chih-Min Chao ,  Peir-Rong Kuo ,  Chia-Hua Chiang ,  Chih-Cheng Hsiao ,  Feng-Ping Kuan ,  Ying-Wei Lee ,  Yung-Chang Juang

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/22 ,  H05K3/38 ,  H05K3/46 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K1/028 ,  H05K1/0393 ,  H05K3/20 ,  H05K3/22 ,  H05K3/386 ,  H05K3/426 ,  H05K3/465 ,  H05K3/4673 ,  H05K2201/0154 ,  Y10T428/24521 ,  Y10T428/265 ,  Y10T428/31678

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract translation: 柔性电路板包括具有凹陷以限定至少隔室的聚酰亚胺层的基板。 隔室包括具有侧壁和底壁的内壁表面。 隔室用于容纳多层单元，其中多层单元包括形成在隔室壁上的粘附增强层，设置在粘附增强层上的第一导电层和形成在第一导电层上的第二导电层 层。 粘附增强层是钯。 第一导电层是镍。 基板由聚酰亚胺（PI）组成。

公开(公告)号：US09386709B2

公开(公告)日：2016-07-05

申请号：US14058504

申请日：2013-10-21

Applicant: ICHIA TECHNOLOGIES, INC.

Inventor： Chien-Hwa Chiu ,  Chih-Min Chao ,  Peir-Rong Kuo ,  Chia-Hua Chiang ,  Chih-Cheng Hsiao ,  Feng-Ping Kuan ,  Ying-Wei Lee ,  Wei-Cheng Lee

IPC: H05K3/02 ,  H05K3/10 ,  H05K3/46 ,  C23C28/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/42 ,  C23C28/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K1/115 ,  C23C18/16 ,  C23C28/021 ,  C23C28/023 ,  C23C28/32 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/111 ,  H05K1/118 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/426 ,  H05K3/46 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/05 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract translation: 制造印刷电路板前体的方法包括提供基板的步骤。 然后催化底物的表面形成催化剂层。 随后，形成导电层并附着到催化层的表面。 最后，将金属层电镀在导电层上。 印刷电路板前体包括具有表面的基板。 具体地，表面被催化处理以形成催化层。 前体还包括附着到覆盖催化剂层的导电层和设置在导电层上的金属层。