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公开(公告)号：US09326374B2
公开(公告)日：2016-04-26
申请号：US13967401
申请日：2013-08-15
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： Chien-Hwa Chiu , Chih-Min Chao , Peir-Rong Kuo , Chia-Hua Chiang , Chih-Cheng Hsiao , Feng-Ping Kuan , Ying-Wei Lee , Yung-Chang Juang
CPC classification number: H05K1/028 , H05K1/0393 , H05K3/20 , H05K3/22 , H05K3/386 , H05K3/426 , H05K3/465 , H05K3/4673 , H05K2201/0154 , Y10T428/24521 , Y10T428/265 , Y10T428/31678
Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).
Abstract translation: 柔性电路板包括具有凹陷以限定至少隔室的聚酰亚胺层的基板。 隔室包括具有侧壁和底壁的内壁表面。 隔室用于容纳多层单元，其中多层单元包括形成在隔室壁上的粘附增强层，设置在粘附增强层上的第一导电层和形成在第一导电层上的第二导电层 层。 粘附增强层是钯。 第一导电层是镍。 基板由聚酰亚胺（PI）组成。
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2.发明申请公开(公告)号：US20150021069A1
公开(公告)日：2015-01-22
申请号：US14058504
申请日：2013-10-21
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： CHIEN-HWA CHIU , Chih-Min Chao , Peir-Rong Kuo , Chia-Hua Chiang , Chih-Cheng Hsiao , Feng-Ping Kuan , Ying-Wei Lee , Wei-Cheng Lee
CPC classification number: H05K1/115 , C23C18/16 , C23C28/021 , C23C28/023 , C23C28/32 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K1/111 , H05K1/118 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/426 , H05K3/46 , H05K2201/0154 , H05K2201/0338 , H05K2201/05 , Y10T29/49124 , Y10T29/49155
Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
Abstract translation: 制造印刷电路板前体的方法包括提供基板的步骤。 然后催化底物的表面形成催化剂层。 随后，形成导电层并附着到催化层的表面。 最后，将金属层电镀在导电层上。 印刷电路板前体包括具有表面的基板。 具体地，表面被催化处理以形成催化层。 前体还包括附着到覆盖催化剂层的导电层和设置在导电层上的金属层。
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公开(公告)号：US09721714B1
公开(公告)日：2017-08-01
申请号：US15229148
申请日：2016-08-05
Applicant: ICHIA TECHNOLOGIES, INC.
Inventor： Yung-Hsiang Sun , Kung-Sheng Tseng , Hsueh-Yuan Fan , Chia-Hua Chiang
CPC classification number: H01F7/20 , H01F17/0033 , H01F17/06 , H01F27/2804 , H01F2007/068 , H01F2017/006 , H05K1/028 , H05K1/165 , H05K2201/052 , H05K2201/056 , H05K2201/086
Abstract: A flexible circuit board includes a substrate and a circuit unit formed on the substrate. The substrate has two carrying segments and a connecting segment, and the two carrying segments are connected by the connecting segment. The circuit unit has a plurality of conductive lines and at least one connecting line, and each conductive line and the connecting line are separated from each other. The conductive lines are respectively formed on the two carrying segments, and the connecting line is formed on the connecting segment and the two carrying segments. Two opposite ends of each carrying segment are configured to connect with each other to form a tubular structure, and two opposite ends of the connecting line are configured to connect to two adjacent conductive lines respectively formed on the two tubular structures, thereby the circuit unit is formed as a coil.
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公开(公告)号：US09386709B2
公开(公告)日：2016-07-05
申请号：US14058504
申请日：2013-10-21
Applicant: ICHIA TECHNOLOGIES, INC.
Inventor： Chien-Hwa Chiu , Chih-Min Chao , Peir-Rong Kuo , Chia-Hua Chiang , Chih-Cheng Hsiao , Feng-Ping Kuan , Ying-Wei Lee , Wei-Cheng Lee
IPC: H05K3/02 , H05K3/10 , H05K3/46 , C23C28/00 , H05K1/09 , H05K1/11 , H05K3/42 , C23C28/02 , H05K3/06 , H05K3/18 , H05K3/38
CPC classification number: H05K1/115 , C23C18/16 , C23C28/021 , C23C28/023 , C23C28/32 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K1/111 , H05K1/118 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/426 , H05K3/46 , H05K2201/0154 , H05K2201/0338 , H05K2201/05 , Y10T29/49124 , Y10T29/49155
Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
Abstract translation: 制造印刷电路板前体的方法包括提供基板的步骤。 然后催化底物的表面形成催化剂层。 随后，形成导电层并附着到催化层的表面。 最后，将金属层电镀在导电层上。 印刷电路板前体包括具有表面的基板。 具体地，表面被催化处理以形成催化层。 前体还包括附着到覆盖催化剂层的导电层和设置在导电层上的金属层。
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