公开(公告)号：US08851385B2

公开(公告)日：2014-10-07

申请号：US13858582

申请日：2013-04-08

Applicant: Identive Group, Inc.

Inventor： Werner Vogt ,  Andreas Looser ,  Christian Looser ,  Andreas Braun

IPC: G06K19/02 ,  G06K19/077 ,  H01L21/50

CPC classification number: G06K19/07749 ,  G06K19/07722 ,  G06K19/07728 ,  H01L21/50

Abstract: Described herein are RFID structures and methods of manufacturing RFID structures. An antenna substrate is provided. A first stack layer is provided. An antenna assembly including an antenna track, and at least two contact pads, are formed on a first surface of the antenna substrate. An integrated circuit unit is coupled to the at least two contact pads. A first surface of the first stack layer, the first surface of the antenna substrate, or both are coated with a unidirectional thermally expansive coating material. The first surface of the antenna substrate is positioned to be adjacent to the first surface of the first stack layer.

Abstract translation: 这里描述了RFID结构和制造RFID结构的方法。 提供天线基板。 提供第一层叠层。 包括天线轨道和至少两个接触焊盘的天线组件形成在天线基板的第一表面上。 集成电路单元耦合到至少两个接触焊盘。 第一堆叠层的第一表面，天线基板的第一表面或两者都涂覆有单向热膨胀涂层材料。 天线基板的第一表面被定位成与第一堆叠层的第一表面相邻。

公开(公告)号：US20130240632A1

公开(公告)日：2013-09-19

申请号：US13858582

申请日：2013-04-08

Applicant: IDENTIVE GROUP, INC.

Inventor： Werner Vogt ,  Andreas Looser ,  Christian Looser ,  Andreas Braun

IPC: G06K19/077 ,  H01L21/50

CPC classification number: G06K19/07749 ,  G06K19/07722 ,  G06K19/07728 ,  H01L21/50

Abstract: Described herein are RFID structures and methods of manufacturing RFID structures. An antenna substrate is provided. A first stack layer is provided. An antenna assembly including an antenna track, and at least two contact pads, are formed on a first surface of the antenna substrate. An integrated circuit unit is coupled to the at least two contact pads. A first surface of the first stack layer, the first surface of the antenna substrate, or both are coated with a unidirectional thermally expansive coating material. The first surface of the antenna substrate is positioned to be adjacent to the first surface of the first stack layer.

Abstract translation: 这里描述了RFID结构和制造RFID结构的方法。 提供天线基板。 提供第一层叠层。 包括天线轨道和至少两个接触焊盘的天线组件形成在天线基板的第一表面上。 集成电路单元耦合到至少两个接触焊盘。 第一堆叠层的第一表面，天线基板的第一表面或两者都涂覆有单向热膨胀涂层材料。 天线基板的第一表面被定位成与第一堆叠层的第一表面相邻。