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    Plastic Card Prelaminate and Plastic Card Including a Phone Sticker
    2.
    发明申请
    Plastic Card Prelaminate and Plastic Card Including a Phone Sticker 审中-公开
    包括电话贴纸在内的塑胶卡片预塑料和塑料卡片

    公开(公告)号：US20140234577A1

    公开(公告)日：2014-08-21

    申请号：US13768547

    申请日：2013-02-15

    Applicant: IDENTIVE GROUP, INC.

    Inventor： Werner Vogt

    IPC: B32B37/14 ,  B32B3/26

    CPC classification number: B32B3/266 ,  B32B37/12 ,  B32B38/0004 ,  B32B2425/00 ,  Y10T156/108 ,  Y10T428/24331

    Abstract: A plastic card prelaminate and a plastic card including a phone sticker, and methods for manufacturing the same are described herein. A first plastic sheet is provided, having a release layer bonded to the first plastic sheet via an adhesive layer. At least one composite structure is provided, the composite structure including a plastic layer including at least one electronic element. A second plastic sheet is provided on top of the first plastic sheet. At least one through-hole is formed in the second plastic sheet, where each through-hole is smaller than the release layer bonded to the first plastic sheet. A composite structure is positioned in each through-hole.

    Abstract translation: 这里描述了塑料卡片预先和包括电话贴纸的塑料卡片及其制造方法。 提供了第一塑料片，其具有通过粘合剂层与第一塑料片接合的剥离层。 提供至少一个复合结构，所述复合结构包括包括至少一个电子元件的塑料层。 第二塑料片设置在第一塑料片的顶部。 在第二塑料片中形成至少一个通孔，其中每个通孔比结合到第一塑料片的剥离层小。 复合结构位于每个通孔中。

    Label Roll Including an Electronic Element
    3.
    发明申请
    Label Roll Including an Electronic Element 审中-公开
    标签卷包括电子元件

    公开(公告)号：US20150010725A1

    公开(公告)日：2015-01-08

    申请号：US13934868

    申请日：2013-07-03

    Applicant: Identive Group, Inc.

    Inventor： Werner Vogt ,  Michael Kober

    IPC: G09F3/00

    CPC classification number: G09F3/0286 ,  G09F3/0288 ,  G09F3/10 ,  Y10T428/15

    Abstract: Described herein is a label roll comprising a liner and a plurality of labels affixed to the liner, wherein each edge of a first label that neighbors another label in a release direction of the label roll comprises (i) at least one protuberance that engages with a recess in an edge of the other label or (ii) at least one recess that is engaged by a protuberance in an edge of the other label.

    Abstract translation: 本文描述的是标签卷，其包括衬垫和固定到衬垫上的多个标签，其中在标签卷的释放方向上邻近另一个标签的第一标签的每个边缘包括（i）至少一个凸起，其与 在另一个标签的边缘处凹进，或（ii）至少一个凹陷，其与另一个标签的边缘中的突起接合。

    Card lamination
    4.
    发明授权
    Card lamination 有权
    卡层压

    公开(公告)号：US08851385B2

    公开(公告)日：2014-10-07

    申请号：US13858582

    申请日：2013-04-08

    Applicant: Identive Group, Inc.

    Inventor： Werner Vogt ,  Andreas Looser ,  Christian Looser ,  Andreas Braun

    IPC: G06K19/02 ,  G06K19/077 ,  H01L21/50

    CPC classification number: G06K19/07749 ,  G06K19/07722 ,  G06K19/07728 ,  H01L21/50

    Abstract: Described herein are RFID structures and methods of manufacturing RFID structures. An antenna substrate is provided. A first stack layer is provided. An antenna assembly including an antenna track, and at least two contact pads, are formed on a first surface of the antenna substrate. An integrated circuit unit is coupled to the at least two contact pads. A first surface of the first stack layer, the first surface of the antenna substrate, or both are coated with a unidirectional thermally expansive coating material. The first surface of the antenna substrate is positioned to be adjacent to the first surface of the first stack layer.

    Abstract translation: 这里描述了RFID结构和制造RFID结构的方法。 提供天线基板。 提供第一层叠层。 包括天线轨道和至少两个接触焊盘的天线组件形成在天线基板的第一表面上。 集成电路单元耦合到至少两个接触焊盘。 第一堆叠层的第一表面，天线基板的第一表面或两者都涂覆有单向热膨胀涂层材料。 天线基板的第一表面被定位成与第一堆叠层的第一表面相邻。

    Dual interface module and dual interface card having a dual interface module manufactured using laser welding
    5.
    发明授权
    Dual interface module and dual interface card having a dual interface module manufactured using laser welding 有权
    双接口模块和双接口卡具有使用激光焊接制造的双接口模块

    公开(公告)号：US09167691B2

    公开(公告)日：2015-10-20

    申请号：US13863834

    申请日：2013-04-16

    Applicant: Identive Group, Inc.

    Inventor： Werner Vogt

    IPC: H05K1/11 ,  G06K19/077 ,  H05K3/32

    CPC classification number: H05K1/112 ,  G06K19/07775 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/113 ,  H05K3/328 ,  H05K2201/10098 ,  H05K2201/10674 ,  Y10T29/49018 ,  Y10T29/49139 ,  H01L2924/00014

    Abstract: Dual interface modules, and methods for manufacturing the same, are described. A substrate layer is provided with at least one dual interface section. At least two first through-holes are formed in the substrate in each dual interface section. A first connection element is arranged in each first through-hole. Each first connection element is connected to a contact pad that is arranged on a first side of the substrate. Each first connection element is connected to a connection pad that is arranged on a second side of the substrate. At least one electronic element is arranged on the second side of the substrate in each dual interface section. Two second through-holes are formed in the substrate in each dual interface section. Two soldering pads with a first side and a second side are arranged on the second side of the substrate layer.

    Abstract translation: 描述了双接口模块及其制造方法。 衬底层设置有至少一个双接口部分。 在每个双界面部分中的基板中形成至少两个第一通孔。 第一连接元件布置在每个第一通孔中。 每个第一连接元件连接到布置在基板的第一侧上的接触焊盘。 每个第一连接元件连接到布置在基板的第二侧上的连接焊盘。 在每个双接口部分中，至少一个电子元件布置在衬底的第二侧上。 在每个双接口部分中的基板中形成两个第二通孔。 具有第一侧和第二侧的两个焊盘布置在衬底层的第二侧上。

    Dual interface module and dual interface card having a dual interface module
    6.
    发明授权
    Dual interface module and dual interface card having a dual interface module 失效
    双接口模块和具有双接口模块的双接口卡

    公开(公告)号：US08763912B1

    公开(公告)日：2014-07-01

    申请号：US13853582

    申请日：2013-03-29

    Applicant: Identive Group, Inc.

    Inventor： Werner Vogt

    IPC: G06K7/08 ,  G06K19/02

    CPC classification number: G06K19/07747 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card.

    Abstract translation: 双接口模块包括具有至少两个第一通孔的衬底层，在衬底的第一侧上的两个接触焊盘，在衬底的第二侧上的至少两个连接焊盘，第二侧上的至少一个电子元件 在衬底的第二侧上包括天线的天线焊盘，在第一通孔中的至少两个第一连接元件，每个第一元件至少将一个接触焊盘与其中一个连接焊盘电连接 两个第二连接元件，每个第二元件将所述连接焊盘中的一个与所述电子元件电连接，以及两个第三连接元件，每个第三元件将所述电子元件与所述天线焊盘电连接。 该模块可以布置在塑料卡体上或塑料卡体中的空腔中以形成双接口卡。

    Dual Interface Module and Dual Interface Card Having a Dual Interface Module Manufactured Using Laser Welding
    8.
    发明申请
    Dual Interface Module and Dual Interface Card Having a Dual Interface Module Manufactured Using Laser Welding 有权
    双接口模块和具有使用激光焊接制造的双接口模块的双接口卡

    公开(公告)号：US20140307405A1

    公开(公告)日：2014-10-16

    申请号：US13863834

    申请日：2013-04-16

    Applicant: Identive Group, Inc.

    Inventor： Werner Vogt

    IPC: H05K1/11 ,  G06K19/077 ,  H05K3/32

    CPC classification number: H05K1/112 ,  G06K19/07775 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/113 ,  H05K3/328 ,  H05K2201/10098 ,  H05K2201/10674 ,  Y10T29/49018 ,  Y10T29/49139 ,  H01L2924/00014

    Abstract: A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card.

    Abstract translation: 双接口模块包括具有至少两个第一通孔的衬底层，在衬底的第一侧上的两个接触焊盘，在衬底的第二侧上的至少两个连接焊盘，第二侧上的至少一个电子元件 在衬底的第二侧上包括天线的天线焊盘，在第一通孔中的至少两个第一连接元件，每个第一元件至少将一个接触焊盘与其中一个连接焊盘电连接 两个第二连接元件，每个第二元件将所述连接焊盘中的一个与所述电子元件电连接，以及两个第三连接元件，每个第三元件将所述电子元件与所述天线焊盘电连接。 该模块可以布置在塑料卡体上或塑料卡体中的空腔中以形成双接口卡。

    Card Lamination
    9.
    发明申请
    Card Lamination 有权
    卡层叠

    公开(公告)号：US20130240632A1

    公开(公告)日：2013-09-19

    申请号：US13858582

    申请日：2013-04-08

    Applicant: IDENTIVE GROUP, INC.

    Inventor： Werner Vogt ,  Andreas Looser ,  Christian Looser ,  Andreas Braun

    IPC: G06K19/077 ,  H01L21/50

    CPC classification number: G06K19/07749 ,  G06K19/07722 ,  G06K19/07728 ,  H01L21/50

    Abstract: Described herein are RFID structures and methods of manufacturing RFID structures. An antenna substrate is provided. A first stack layer is provided. An antenna assembly including an antenna track, and at least two contact pads, are formed on a first surface of the antenna substrate. An integrated circuit unit is coupled to the at least two contact pads. A first surface of the first stack layer, the first surface of the antenna substrate, or both are coated with a unidirectional thermally expansive coating material. The first surface of the antenna substrate is positioned to be adjacent to the first surface of the first stack layer.

    Abstract translation: 这里描述了RFID结构和制造RFID结构的方法。 提供天线基板。 提供第一层叠层。 包括天线轨道和至少两个接触焊盘的天线组件形成在天线基板的第一表面上。 集成电路单元耦合到至少两个接触焊盘。 第一堆叠层的第一表面，天线基板的第一表面或两者都涂覆有单向热膨胀涂层材料。 天线基板的第一表面被定位成与第一堆叠层的第一表面相邻。

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