公开(公告)号：US20160274321A1

公开(公告)日：2016-09-22

申请号：US15075126

申请日：2016-03-19

Applicant: II-VI Incorporated

Inventor： Ian Peter McClean ,  Aravanan Gurusami ,  Richard Smart ,  Mark H. Garrett ,  Mark Filipowicz

IPC: G02B6/42 ,  G02B6/36 ,  G02B6/12

CPC classification number: G02B6/3608 ,  G02B6/421 ,  G02B6/4292 ,  G02B6/43

Abstract: Optical modules as used in various types of communication systems are formed to include a flexible substrate to support various optical, electronic, and opto-electronic module components in a manner that can accommodate various packaging constraints. The flexible substrate is formed of a polyimide film is known to exhibit excellent electrical isolation properties, even though the films are generally relatively thin (on the order of 10-100 μms, in most cases). The flexible polyimide film is sized to accommodate the constraints of a given package “footprint”; more particularly, sized to fit an open ‘floor area’ within package, allowing for a populated film to be placed around various other “fixed-in-place” elements . The polyimide film is easily cut and trimmed to exhibit whatever topology is convenient, while providing enough surface area to support the affixed components and associated optical fiber traces.

Abstract translation: 在各种通信系统中使用的光学模块被形成为包括柔性基板，以可以适应各种封装约束的方式支持各种光学，电子和光电模块部件。 已知聚酰亚胺膜形成的柔性基板即使膜通常相对较薄（在大多数情况下，大约为10-100微米），表现出优异的电绝缘性能。 柔性聚酰亚胺膜的尺寸适应于给定封装“封面”的限制; 更具体地，尺寸适合于包装内的开放的“地板区域”，允许将人口化的膜放置在各种其它“固定就位”元件周围。 聚酰亚胺膜易于切割和修整，以显示出任何方便的拓扑结构，同时提供足够的表面积来支撑固定的部件和相关联的光纤迹线。