Abstract:
A multi-chip integrated package design system includes a model analysis, a 3D model analysis and an electrical simulation. The model analysis obtains a pin connection mode of the designed circuit according to a designed circuit, obtains at least one conductive layer of the designed circuit according to a layer stackup, selects a transmission line model that meets the pin connection mode and at least one conductive layer, substitutes the layer stackup and a design rule into the selected transmission line model to generate an equivalent circuit, generates a corresponding relationship according to the equivalent circuit, and obtains the transmission line length corresponding to a parameter design target according to the corresponding relationship. The 3D model analysis constructs a 3D model of the designed circuit according to the obtained the transmission line length. The electrical simulation determines whether the characteristic parameter of the 3D model meets the parameter design target.
Abstract:
An apparatus and method for generating a power delivery network (PDN) of a circuit system is provided. The apparatus performs a power diagnostics on the PDN of a circuit system. According to result of the power diagnostics, a number of areas are generated and divided into at least three subsets. At least one area is selected from each of the at least three subsets, and one node is selected from each of the selected areas, and the nodes are connected orderly to form an interconnection with at least three nodes in the PDN.
Abstract:
A method for generating a power distribution network (PDN) is provided. A heterogeneous circuit data is input. A plurality of horizontal power lines and a plurality of vertical power lines are determined according to the heterogeneous circuit data. A PDN model of the heterogeneous circuit is determined according to the horizontal power lines and the vertical power lines. Power consumption value is assigned to a plurality of internal nodes of the PDN model of the heterogeneous circuit. The PDN model of the heterogeneous circuit is adjusted to meet a target voltage drop limitation of the heterogeneous circuit data.