公开(公告)号：US20170158932A1

公开(公告)日：2017-06-08

申请号：US14974616

申请日：2015-12-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Hui-Wen CHANG ,  Hsiang-Yen TSAO ,  Kuo-Chan CHIOU

IPC: C09K5/14 ,  C08G59/50 ,  C08G59/22

CPC classification number: C09K5/14 ,  C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/50 ,  C08G59/5033 ,  H01L23/3737

Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4′-methylenedianiline, 4,4′-ethylenedianiline, 4,4′-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

公开(公告)号：US20240209154A1

公开(公告)日：2024-06-27

申请号：US18184034

申请日：2023-03-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Kuang CHIANG ,  Jyh-Long JENG ,  Hsiang-Yen TSAO

IPC: C08G77/04 ,  C08K5/00 ,  C09K5/10

CPC classification number: C08G77/045 ,  C08K5/005 ,  C09K5/10

Abstract: A polymer is formed by reacting a terminating agent with a star polymer. The star polymer is formed by reacting a core molecule with a hydroxy terminated silicone oil. The core molecule includes a plurality of alkoxysilyl groups, a plurality of hydroxysilyl groups, or a combination thereof. The polymer can be mixed with antioxidant and metal deactivator to form a dielectric fluid, which can be used in a cooling system.

公开(公告)号：US20240228854A1

公开(公告)日：2024-07-11

申请号：US18180609

申请日：2023-03-08

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsiang-Yen TSAO ,  Hui-Wen CHANG ,  Jyh-Long JENG

IPC: C09K5/14 ,  C08G59/02 ,  C08G69/40

CPC classification number: C09K5/14 ,  C08G59/02 ,  C08G69/40

Abstract: A polymer is formed by reacting (a) benzaldazine compound with (b1) diamine compound, (b2) dianhydride compound, (b3) epoxy resin, or a combination thereof, wherein (a) benzaldazine compound has a chemical structure of




in which R1 is —NH2, —OH, or




The polymer can be combined with inorganic powder to form a thermal interface material.

公开(公告)号：US20190211138A1

公开(公告)日：2019-07-11

申请号：US16146084

申请日：2018-09-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Min-Chian WANG ,  Hsiang-Yen TSAO ,  Kuo-Chan CHIOU

IPC: C08G59/22 ,  C08G59/50 ,  C08K3/22 ,  C08G59/24 ,  C08G59/52 ,  C08G59/56 ,  C09D163/00 ,  C09K5/14

CPC classification number: C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/5026 ,  C08G59/5033 ,  C08G59/52 ,  C08G59/56 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/001 ,  C09D163/00 ,  C09K5/14

Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.