公开(公告)号：US20130312822A1

公开(公告)日：2013-11-28

申请号：US13761278

申请日：2013-02-07

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hung-Yi LIN ,  Ta-Hsin CHOU ,  Jen-Hui TSAI ,  Chia-Chen HSU ,  Jian-Hung LIN ,  Hung-Chih KAN

IPC: H01L31/0352 ,  H01L31/0224

CPC classification number: H01L31/035281 ,  H01L31/022425 ,  H01L31/02366 ,  H01L31/03923 ,  Y02E10/541

Abstract: The disclosure provides a solar-cell device, including a substrate, a first electrode layer comprising a first two-dimensional periodic structure disposed on the substrate, a first light conversion layer disposed on the first two-dimensional periodic structure, a second light conversion layer disposed on the first light conversion layer; and a second electrode layer disposed on the second light conversion layer.

Abstract translation: 本发明提供一种太阳能电池装置，包括基板，包括设置在基板上的第一二维周期结构的第一电极层，设置在第一二维周期结构上的第一光转换层，第二光转换层 设置在第一光转换层上; 以及设置在第二光转换层上的第二电极层。

公开(公告)号：US20130241590A1

公开(公告)日：2013-09-19

申请号：US13887091

申请日：2013-05-03

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Min-Chieh CHOU ,  Tune-Hune KAO ,  Jen-Hui TSAI

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2886 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/073 ,  G01R3/00

Abstract: A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump.

Abstract translation: 提供一种形成导电膜结构的方法，其包括：提供具有表面的绝缘基板; 在所述绝缘基板的表面中形成多个沟槽，其中所述沟槽基本上彼此平行地延伸; 将所述绝缘基板设置在电镀液中，并对所述沟槽内的导电层进行电镀以形成多根微线; 并且堆叠多个绝缘基板或者沿着基本上平行于微线的延伸方向的轴线缠绕或折叠绝缘基板以形成导电块。