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    Environmental sensitive electronic device package having side wall barrier structure
    4.
    发明授权
    Environmental sensitive electronic device package having side wall barrier structure 有权
    具有侧壁屏障结构的环境敏感电子器件封装

    公开(公告)号：US09450202B2

    公开(公告)日：2016-09-20

    申请号：US14065434

    申请日：2013-10-29

    Applicant: Industrial Technology Research Institute

    Inventor： Kuang-Jung Chen

    IPC: H01L51/52 ,  G02F1/1333

    CPC classification number: H01L51/5246 ,  G02F1/133308 ,  G02F2001/133311 ,  G02F2201/50 ,  H01L51/5281

    Abstract: An environmental sensitive electronic device package having side wall barrier structure may include a first substrate, a second substrate, an environmental sensitive electronic device, a first adhesive, a third substrate, at least one first side wall barrier structure, and a second adhesive. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located between the first and second substrates and covers the environmental sensitive electronic device. The third substrate is located below the first substrate. The first substrate is located between the second and third substrates. The first side wall barrier structure is located on the third substrate and between the first and the third substrates, wherein the first side wall barrier structure is embedded in the first substrate. The second adhesive is located between the first and third substrates and covers the second first side wall barrier structure.

    Abstract translation: 具有侧壁阻挡结构的环境敏感的电子器件封装可以包括第一衬底，第二衬底，环境敏感电子器件，第一粘合剂，第三衬底，至少一个第一侧壁阻挡结构和第二粘合剂。 环境敏感电子设备位于第一基板上。 第一粘合剂位于第一和第二基底之间并覆盖环境敏感的电子设备。 第三基板位于第一基板的下方。 第一基板位于第二和第三基板之间。 第一侧壁阻挡结构位于第三基板上并且位于第一和第三基板之间，其中第一侧壁阻挡结构嵌入第一基板。 第二粘合剂位于第一和第三基底之间并且覆盖第二第一侧壁阻挡结构。

    Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof
    5.
    发明授权
    Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof 有权
    功能膜，环境敏感电子器件封装及其制造方法

    公开(公告)号：US09252389B2

    公开(公告)日：2016-02-02

    申请号：US13909082

    申请日：2013-06-04

    Applicant: Industrial Technology Research Institute

    Inventor： Kuang-Jung Chen

    IPC: H01L51/52

    CPC classification number: H01L51/5246 ,  B32B7/14 ,  B32B2307/748 ,  B32B2457/00 ,  H01L51/5253 ,  H01L2251/5338 ,  H01L2924/0002 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/1476 ,  H01L2924/00

    Abstract: An environmentally sensitive electronic device package including a first adhesive, at least one first side wall barrier, a first substrate, and a second substrate is provided. The first adhesive has a first surface and a second surface opposite to the first surface. The first side wall barrier is distributed in the first adhesive. The first substrate is bonded with the first surface. The first substrate has an environmentally sensitive electronic device formed thereon and the environmentally sensitive electronic device is surrounded by the first side wall barrier. The second substrate is bonded with the second surface. A manufacturing method of the environmentally sensitive electronic device package is also provided.

    Abstract translation: 提供了包括第一粘合剂，至少一个第一侧壁屏障，第一基板和第二基板的环境敏感的电子设备封装。 第一粘合剂具有与第一表面相对的第一表面和第二表面。 第一侧壁屏障分布在第一粘合剂中。 第一衬底与第一表面结合。 第一基板在其上形成有环境敏感的电子设备，并且环境敏感的电子设备被第一侧壁屏障包围。 第二基板与第二表面结合。 还提供了一种对环境敏感的电子设备封装的制造方法。

    BARRIER FUNCTIONAL FILM AND MANUFACTURING THEREOF, ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE, AND DISPLAY APPARATUS
    6.
    发明申请
    BARRIER FUNCTIONAL FILM AND MANUFACTURING THEREOF, ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE, AND DISPLAY APPARATUS 有权
    屏障功能膜及其制造方法，环境敏感电子设备及显示设备

    公开(公告)号：US20140118638A1

    公开(公告)日：2014-05-01

    申请号：US14051461

    申请日：2013-10-11

    Applicant: Industrial Technology Research Institute

    Inventor： Kuang-Jung Chen

    IPC: G02B26/00 ,  H05K7/06 ,  G02B5/32

    CPC classification number: G02B1/14 ,  G02B1/105 ,  H05K7/06 ,  Y10T156/10 ,  Y10T428/1414 ,  Y10T428/1438 ,  Y10T428/1476

    Abstract: A barrier functional film that includes a substrate, at least one side wall barrier structure, a releasing film, and an adhesive is provided. The side wall barrier structure is located on the substrate. The releasing film is located above the substrate, and the side wall barrier structure is located between the substrate and the releasing film. The adhesive covers the side wall barrier structure and is located between the substrate and the releasing film. An environmental sensitive electronic device, a display apparatus, and a manufacturing method of a barrier functional film are also provided.

    Abstract translation: 提供了包括基板，至少一个侧壁阻挡结构，脱模膜和粘合剂的阻挡功能膜。 侧壁阻挡结构位于基板上。 剥离膜位于基板上方，侧壁阻挡结构位于基板和剥离膜之间。 粘合剂覆盖侧壁阻挡结构并且位于基底和释放膜之间。 还提供了一种环境敏感的电子设备，显示设备和阻挡功能膜的制造方法。

    TOUCH-SENSING DISPLAY PANEL
    9.
    发明申请
    TOUCH-SENSING DISPLAY PANEL 审中-公开

    公开(公告)号：US20170102806A1

    公开(公告)日：2017-04-13

    申请号：US15287735

    申请日：2016-10-07

    Applicant: Industrial Technology Research Institute

    Inventor： Chih-Chia Chang ,  Kuang-Jung Chen ,  Yi-Chuan Lu ,  Kai-Ming Chang

    IPC: G06F3/041

    CPC classification number: G06F3/0412 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  G06F2203/04112

    Abstract: In an embodiment of the disclosure, a touch-sensing display panel includes a substrate, connection electrodes, a touch-sensing device layer, a buffer layer, a display device, and conductive vias. The substrate has a display area and a non-display area connecting the display area. The connection electrodes are located on the non-display area of the substrate. The touch-sensing device layer is located on the substrate. The buffer layer covers the touch-sensing device layer. The display device including a first electrode layer, a second electrode layer, and a display medium layer is disposed on the buffer layer and corresponds to the display area. The first electrode layer and the second electrode layer extend from the display area to the non-display area. The conductive vias penetrate the buffer layer and correspond to the non-display area. The first electrode layer and the second electrode layer are electrically connected to the connection electrodes via the conductive vias.

    Environmental sensitive electronic device package
    10.
    发明授权
    Environmental sensitive electronic device package 有权
    环保电子设备包装

    公开(公告)号：US09288897B2

    公开(公告)日：2016-03-15

    申请号：US14065435

    申请日：2013-10-29

    Applicant: Industrial Technology Research Institute

    Inventor： Kuang-Jung Chen ,  Wei-Yi Lin

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/0281 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2201/2036

    Abstract: An environmental sensitive electronic device package includes a first substrate, a second substrate, an environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer. The first substrate has at least one predetermined flexure area. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate and between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate and surrounds the environmental sensitive electronic device. The side wall barrier structure has at least one flexure stress dispersing structure that is located in the predetermined flexure area. The filler layer is located between the first substrate and the second substrate and covers the side wall barrier structure and the environmental sensitive electronic device.

    Abstract translation: 环境敏感电子器件封装包括第一衬底，第二衬底，环境敏感电子器件，至少一个侧壁阻挡结构和填充层。 第一基板具有至少一个预定的弯曲区域。 第二基板位于第一基板的上方。 环境敏感电子器件位于第一衬底上，并位于第一衬底和第二衬底之间。 侧壁阻挡结构位于第一基板和第二基板之间并且环绕环境敏感的电子设备。 侧壁阻挡结构具有位于预定弯曲区域中的至少一个挠曲应力分散结构。 填充层位于第一基板和第二基板之间，并且覆盖侧壁阻挡结构和环境敏感电子设备。

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