公开(公告)号：US20170170146A1

公开(公告)日：2017-06-15

申请号：US14970444

申请日：2015-12-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chih-Ming SHEN ,  Shih-Hsien WU ,  Ming-Ji DAI

IPC: H01L25/065 ,  H01L23/498 ,  H01L21/768 ,  H01L21/683 ,  H01L21/56

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/76877 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/19 ,  H01L25/0657 ,  H01L25/117 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2224/83

Abstract: A semiconductor device is provided. The semiconductor device includes at least one first die, a rib structure enclosing the at least one first die, and a molding layer covering the at least one first die. The rib structure is formed of a first material and the molding layer is formed of a second material. A Young's modulus of the first material is larger than a Young's modulus of the second material.

公开(公告)号：US20180129763A1

公开(公告)日：2018-05-10

申请号：US15373761

申请日：2016-12-09

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ming-Kan LIANG ,  Wei LI ,  Chih-Ming SHEN ,  Ming-Ji DAI ,  Chia-Wei JUI

IPC: G06F17/50 ,  A43D1/02 ,  A61F5/01 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y50/02 ,  B29C67/00

CPC classification number: G06F17/5018 ,  A43D1/025 ,  A61F5/0195 ,  B29C64/386 ,  B29D35/0009 ,  B29K2027/06 ,  B29L2031/753 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of manufacturing a foot auxiliary equipment includes the following steps. Firstly, a foot appearance of a foot and a foot muscle of the foot are scanned for obtaining a foot appearance data model and a foot muscle data s model respectively. Then, the foot appearance data model and the foot muscle data model are synthesized into a foot data model. Then, a dynamic state analysis and a static state analysis are performed on the foot data model. Then, a foot auxiliary equipment data model is generated according to result of the dynamic state analysis and result of the static state analysis. Then, a foot auxiliary equipment is printed by using three-dimensional printing technique according to the foot auxiliary equipment data model.

公开(公告)号：US20180136287A1

公开(公告)日：2018-05-17

申请号：US15352989

申请日：2016-11-16

Applicant: Industrial Technology Research Institute

Inventor： Chih-Chung CHIU ,  Chih-Ming TZENG ,  Li-Ling LIAO ,  Yu-Lin CHAO ,  Chih-Ming SHEN ,  Ming-Kaan LIANG ,  Chun-Kai LIU ,  Ming-Ji DAI

IPC: G01R31/40 ,  H05K5/00 ,  H05K5/03 ,  G01R27/26 ,  G01R21/06

CPC classification number: G01R31/40 ,  G01R21/06 ,  G01R31/003 ,  H02P27/08 ,  H02P29/68

Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.

公开(公告)号：US20180033772A1

公开(公告)日：2018-02-01

申请号：US15730256

申请日：2017-10-11

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chih-Ming SHEN ,  Shih-Hsien WU ,  Ming-Ji DAI

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L21/683

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/76877 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/19 ,  H01L25/0657 ,  H01L25/117 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2224/83

Abstract: A semiconductor device is provided. The semiconductor device includes at least one first die, a rib structure enclosing the at least one first die, and a molding layer covering the at least one first die. The rib structure is formed of a first material and the molding layer is formed of a second material. A Young's modulus of the first material is larger than a Young's modulus of the second material. The rib structure includes a through hole, and the through hole is filled with a conductive material.