公开(公告)号：US20240219239A1

公开(公告)日：2024-07-04

申请号：US18201996

申请日：2023-05-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Wen HSU ,  Lu-Pu LIAO ,  Chao-Ta HUANG ,  Bo-Kai CHAO

IPC: G01J5/20 ,  H10N19/00

CPC classification number: G01J5/20 ,  H10N19/00

Abstract: A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots. The surrounding sensing film surrounds the central sensing film. Each of the connecting portions connects the surrounding sensing film and the central sensing film. A central distance from the bottom absorbing layer of the central sensing film to the silicon substrate is substantially equal to a surrounding distance from the bottom absorbing layer of the surrounding sensing film to the silicon substrate.

公开(公告)号：US20210198101A1

公开(公告)日：2021-07-01

申请号：US16882039

申请日：2020-05-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Bor-Shiun LEE ,  Ming-Fa CHEN ,  Yu-Wen HSU ,  Chao-Ta HUANG

IPC: B81B7/02 ,  B81C1/00 ,  G01L19/00 ,  G01N27/22 ,  G01K7/18

Abstract: The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.

公开(公告)号：US20220205861A1

公开(公告)日：2022-06-30

申请号：US17234260

申请日：2021-04-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jen-Chieh LI ,  Tzung-Ching LEE ,  Yu-Wen HSU ,  Chao-Ta HUANG

IPC: G01L27/00

Abstract: A calibration system for calibrating pressure sensor comprises communication pipe, base, inlet valve, outlet valve, pump, inlet pipe, heater and reference pressure sensor. The communication pipe has first and second openings. The base comprises chamber body and outlet being disposed at the chamber body. The inlet valve is disposed at the first opening. The chamber body is connected to the second opening so as to define a space between the inlet valve and the outlet valve. The heater is to heat a fluid in the space. The reference pressure sensor is configured to measure a pressure of the fluid. The at least one target pressure sensor is detachably mounted on the chamber body via the base so as to measure the pressure of the fluid in the space.

公开(公告)号：US20200212826A1

公开(公告)日：2020-07-02

申请号：US16235054

申请日：2018-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Wen HSU ,  Che-Kai YEH ,  Chin-Fu KUO ,  Chao-Ta HUANG

IPC: H02N1/00 ,  B81B3/00 ,  B81B7/00

Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.