公开(公告)号：US09754854B2

公开(公告)日：2017-09-05

申请号：US13650023

申请日：2012-10-11

Applicant: Infineon Technologies AG

Inventor： Ralf Otremba ,  Marco Seibt

IPC: H01L23/34 ,  H01L23/495 ,  H01L23/31 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/34 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/73 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a power semiconductor chip having a control electrode, a first load electrode and a second load electrode. The package also includes a first terminal conductor electrically coupled to the control electrode, a second terminal conductor electrically coupled to the first load electrode and a third terminal conductor electrically coupled to the second load electrode. Further, the package includes a temperature sensor electrically coupled to at least two of the first, second and third terminal conductor.

公开(公告)号：US20140103902A1

公开(公告)日：2014-04-17

申请号：US13650023

申请日：2012-10-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Ralf Otremba ,  Marco Seibt

IPC: H01L23/544 ,  G01R19/00 ,  G01K7/01

CPC classification number: H01L23/34 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/73 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a power semiconductor chip having a control electrode, a first load electrode and a second load electrode. The package also includes a first terminal conductor electrically coupled to the control electrode, a second terminal conductor electrically coupled to the first load electrode and a third terminal conductor electrically coupled to the second load electrode. Further, the package includes a temperature sensor electrically coupled to at least two of the first, second and third terminal conductor.

Abstract translation: 半导体封装包括具有控制电极，第一负载电极和第二负载电极的功率半导体芯片。 封装还包括电耦合到控制电极的第一端子导体，电耦合到第一负载电极的第二端子导体和电耦合到第二负载电极的第三端子导体。 此外，封装包括电耦合到第一，第二和第三端子导体中的至少两个的温度传感器。

公开(公告)号：US09230889B2

公开(公告)日：2016-01-05

申请号：US13742426

申请日：2013-01-16

Applicant: Infineon Technologies AG

Inventor： Ralf Otremba ,  Marco Seibt

IPC: H01L23/29 ,  H01L23/373 ,  H01L23/495 ,  H01L21/56 ,  H01L23/433 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/495 ,  H01L21/56 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3731 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/291 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed over a side of the carrier.

Abstract translation: 提供了芯片布置，芯片布置包括：载体; 至少一个芯片，包括设置在所述载体上的至少一个接触焊盘; 至少部分地围绕所述至少一个芯片和所述载体的封装材料; 以及设置在载体的一侧上的至少一个低温共烧陶瓷片。

公开(公告)号：US20140197523A1

公开(公告)日：2014-07-17

申请号：US13742426

申请日：2013-01-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Ralf Otremba ,  Marco Seibt

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/495 ,  H01L21/56 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3731 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/291 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed over a side of the carrier.

Abstract translation: 提供了芯片布置，芯片布置包括：载体; 至少一个芯片，包括设置在所述载体上的至少一个接触焊盘; 至少部分地围绕所述至少一个芯片和所述载体的封装材料; 以及设置在载体的一侧上的至少一个低温共烧陶瓷片。