公开(公告)号：US20140110820A1

公开(公告)日：2014-04-24

申请号：US13654447

申请日：2012-10-18

Applicant: INFINEON TECHNOLOGIES AUSTRIA AG

Inventor： Martin STANDING ,  Milko PAOLUCCI

IPC: H01L21/50 ,  H01L27/06

CPC classification number: H01L23/49822 ,  H01L23/36 ,  H01L23/367 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.

Abstract translation: 器件和技术的代表性实现提供了设置在分层印刷电路板（PCB）内的芯片芯片的改进的热性能。 无源元件可以策略地位于PCB的一个或多个表面上。 无源部件可以被布置成将由芯片管芯产生的热量从芯片管芯移出。