公开(公告)号：US20160270219A1

公开(公告)日：2016-09-15

申请号：US15033836

申请日：2014-10-24

Applicant: INGENICO GROUP

Inventor： Stephane Pavageau ,  Xavier Lambert

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/10 ,  B23K1/00

CPC classification number: H05K1/0284 ,  B23K1/0016 ,  B23K2101/42 ,  G06F21/86 ,  G06K7/0091 ,  H05K1/0275 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/1275 ,  H05K3/143 ,  H05K3/245 ,  H05K3/34 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/10204 ,  H05K2203/0551

Abstract: A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.

Abstract translation: 提供了用于制造电子设备的支撑件。 支撑件包括至少一个待保护的部件和至少一个至少等于电子部件高度的高度的三维元件。 三维元件与要保护的至少一个部件横向相对设置。 三维元素主要由永久组装材料构成。

公开(公告)号：US09980374B2

公开(公告)日：2018-05-22

申请号：US15033836

申请日：2014-10-24

Applicant: INGENICO GROUP

Inventor： Stephane Pavageau ,  Xavier Lambert

IPC: H05K7/00 ,  H05K1/02 ,  G06K7/00 ,  G06F21/86 ,  B23K1/00 ,  H05K3/10 ,  H05K3/34 ,  H05K3/12 ,  H05K3/14 ,  H05K3/24 ,  B23K101/42

CPC classification number: H05K1/0284 ,  B23K1/0016 ,  B23K2101/42 ,  G06F21/86 ,  G06K7/0091 ,  H05K1/0275 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/1275 ,  H05K3/143 ,  H05K3/245 ,  H05K3/34 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/10204 ,  H05K2203/0551

Abstract: A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.