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    LOW COST VEHICLE ELECTRICAL AND ELECTRONIC COMPONENTS AND SYSTEMS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS
    1.
    发明申请
    LOW COST VEHICLE ELECTRICAL AND ELECTRONIC COMPONENTS AND SYSTEMS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS 审中-公开
    低成本车载电气和电子元件和系统由导电负载树脂材料制造

    公开(公告)号：US20140272117A1

    公开(公告)日：2014-09-18

    申请号：US14293315

    申请日：2014-06-02

    Applicant: INTEGRAL TECHNOLOGIES, INC.

    Inventor： THOMAS AISENBREY

    IPC: H01B13/00

    CPC classification number: H01B13/0026 ,  B60R16/02 ,  H01B1/22

    Abstract: Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

    Abstract translation: 车载电气和电子部件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

    VARIABLE-THICKNESS ELECRIPLAST MOLDABLE CAPSULE AND METHOD OF MANUFACTURE
    3.
    发明申请
    VARIABLE-THICKNESS ELECRIPLAST MOLDABLE CAPSULE AND METHOD OF MANUFACTURE 审中-公开
    可变厚度立体可塑胶囊及其制造方法

    公开(公告)号：US20160176095A1

    公开(公告)日：2016-06-23

    申请号：US15056406

    申请日：2016-02-29

    Applicant: INTEGRAL TECHNOLOGIES, INC.

    Inventor： THOMAS AISENBREY

    IPC: B29C47/02 ,  B29B11/16 ,  B29C70/52

    CPC classification number: B29C48/15 ,  B29B11/16 ,  B29C48/0022 ,  B29C48/05 ,  B29C48/12 ,  B29C48/154 ,  B29C48/287 ,  B29C48/2883 ,  B29C48/2886 ,  B29C48/297 ,  B29C48/30 ,  B29C48/34 ,  B29C48/355 ,  B29C48/832 ,  B29C70/521 ,  B29C70/523 ,  B29C2793/0027 ,  B29K2105/12 ,  B29K2105/16 ,  B29K2995/0005 ,  B29K2995/0011 ,  B29L2031/3456

    Abstract: A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2), A method (100) to form a moldable capsule (1) including extruding/pultruding resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3), The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2), The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is .disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extended/pultruded resin-based material and bundle are section into moldable capsules.

    Abstract translation: 可成型胶囊装置（1）包括一束微米导电纤维（3）和沿胶囊长度（L）覆盖的树脂基材料层（5），其中树脂基材料层的厚度不是 均匀（T1和T2），A形成可塑性胶囊（1）的方法（100），包括在微米导电纤维束（3）的长度（L）上挤出/拉挤树脂基材料层（5） 树脂基材料层（5）具有第一厚度（T1）和第二厚度（T2）。第一厚度（T1）设置在束的多个第一表面（7）周围。 围绕束的多个第二表面（9）设置第二厚度（T2）。 第二厚度（T2）至少是第一厚度（T1）的两倍。 延伸/拉挤树脂基材料和束是可成型的胶囊的部分。

    LOW COST ELECTRICAL MOTOR COMPONENTS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS
    6.
    发明申请
    LOW COST ELECTRICAL MOTOR COMPONENTS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS 审中-公开
    由导电负载树脂材料制造的低成本电动机组件

    公开(公告)号：US20140246800A1

    公开(公告)日：2014-09-04

    申请号：US14278837

    申请日：2014-05-15

    Applicant: INTEGRAL TECHNOLOGIES, INC.

    Inventor： THOMAS AISENBREY

    IPC: B29C70/88 ,  B29C45/00

    CPC classification number: B29C70/882 ,  B29C45/0013 ,  C22C5/06 ,  C22C9/00 ,  C22C19/03 ,  C22C49/02 ,  C22C49/14 ,  H01R39/025 ,  H01R39/20 ,  H02K1/02 ,  H02K5/02 ,  H02K2213/03 ,  Y10T29/49009 ,  Y10T29/49011 ,  Y10T29/49012

    Abstract: Electric motor components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

    Abstract translation: 电动机部件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

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