公开(公告)号：US20170170134A1

公开(公告)日：2017-06-15

申请号：US15396845

申请日：2017-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JEAN AUDET ,  LUC G. GUERIN ,  RICHARD LANGLOIS ,  STEPHAN L. MARTEL ,  SYLVAIN E. OUIMET

IPC: H01L23/00

CPC classification number: H01L24/08 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/08265 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/92125 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

公开(公告)号：US20170170133A1

公开(公告)日：2017-06-15

申请号：US15396844

申请日：2017-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JEAN AUDET ,  LUC G. GUERIN ,  RICHARD LANGLOIS ,  STEPHAN L. MARTEL ,  SYLVAIN E. OUIMET

IPC: H01L23/00

CPC classification number: H01L24/08 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/08265 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/92125 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.