公开(公告)号：US10559549B2

公开(公告)日：2020-02-11

申请号：US15432015

申请日：2017-02-14

Applicant: International Business Machines Corporation

Inventor： David Danovitch ,  Yolande Elodie Nguena Dongmo ,  Richard Langlois

IPC: H01L23/00 ,  B23K1/018 ,  B23K3/08

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

公开(公告)号：US20180233482A1

公开(公告)日：2018-08-16

申请号：US15432015

申请日：2017-02-14

Applicant: International Business Machines Corporation

Inventor： David Danovitch ,  Yolande Elodie Nguena Dongmo ,  Richard Langlois

IPC: H01L23/00 ,  B23K1/018 ,  B23K3/08

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

公开(公告)号：US10679966B2

公开(公告)日：2020-06-09

申请号：US15818092

申请日：2017-11-20

Applicant: International Business Machines Corporation

Inventor： David Danovitch ,  Yolande Elodie Nguena Dongmo ,  Richard Langlois

IPC: H01L23/00 ,  B23K1/018 ,  B23K3/08

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

公开(公告)号：US09984988B2

公开(公告)日：2018-05-29

申请号：US15396845

申请日：2017-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jean Audet ,  Luc G. Guerin ,  Richard Langlois ,  Stephan L. Martel ,  Sylvain E. Ouimet

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/08 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/08265 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/92125 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

公开(公告)号：US09553079B1

公开(公告)日：2017-01-24

申请号：US14969765

申请日：2015-12-15

Applicant: International Business Machines Corporation

Inventor： Jean Audet ,  Luc G. Guerin ,  Richard Langlois ,  Stephan L. Martel ,  Sylvain E. Ouimet

IPC: H01L21/00 ,  H01L25/16 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L49/02

CPC classification number: H01L24/08 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/08265 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73201 ,  H01L2224/73204 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/92125 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Abstract translation: 公开了一种倒装芯片组件，其包括具有管芯电路的管芯和电连接到管芯电路的多个电触点。 衬底包括与相应的管芯电触头并置并电连接的电触头。 无源部件设置在管芯和衬底之间，并且包括设置在第一电极和第二电极之间的电介质。 第一电极电连接到第一管芯电触点和对应的衬底电接触，并且第二电极电连接到第二管芯电触点和相应的衬底电接触。

公开(公告)号：US10211174B2

公开(公告)日：2019-02-19

申请号：US15396844

申请日：2017-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jean Audet ,  Luc G. Guerin ,  Richard Langlois ,  Stephan L. Martel ,  Sylvain E. Ouimet

IPC: H01L23/00 ,  H01L25/16 ,  H01L23/498 ,  H01L49/02

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

公开(公告)号：US20180233483A1

公开(公告)日：2018-08-16

申请号：US15818092

申请日：2017-11-20

Applicant: International Business Machines Corporation

Inventor： David Danovitch ,  Yolande Elodie Nguena Dongmo ,  Richard Langlois

IPC: H01L23/00 ,  B23K3/08 ,  B23K1/018

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.