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    ELECTRONIC MODULE POWER SUPPLY
    1.
    发明申请
    ELECTRONIC MODULE POWER SUPPLY 审中-公开

    公开(公告)号：US20190306977A1

    公开(公告)日：2019-10-03

    申请号：US16446919

    申请日：2019-06-20

    Applicant: International Business Machines Corporation

    Inventor： Michael A. Christo ,  Julio A. Maldonado ,  Roger D. Weekly ,  Tingdong Zhou

    IPC: H05K1/11 ,  H05K1/02

    Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

    Electronic module power supply
    4.
    发明授权
    Electronic module power supply 有权
    电子模块电源

    公开(公告)号：US09456498B2

    公开(公告)日：2016-09-27

    申请号：US14040659

    申请日：2013-09-28

    Applicant: International Business Machines Corporation

    Inventor： Michael A. Christo ,  Julio A. Maldonado ,  Roger D. Weekly ,  Tingdong Zhou

    IPC: H05K1/00 ,  H05K3/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/34

    CPC classification number: H05K1/112 ,  H05K1/0263 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/1028 ,  Y10T29/49128 ,  Y10T29/49155

    Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

    Abstract translation: 可以根据各种技术向电子模块供电。 在一般的实施方案中，例如，用于向电子模块供电的系统可以包括印刷电路板，电子模块和导电箔。 板可以包括在第一侧上的多个接触位置，其中至少一个接触位置电耦合到通孔到板的第二侧。 电子模块可以电耦合到板的第一侧上的接触位置，并且通过电耦合到通孔的至少一个接触位置接收电力。 箔可以适于传送用于电子模块的电力并且电耦合到电路板的第二侧上至少通过电气耦合到接收用于电子模块的电力的接触位置的通孔。

    Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density
    5.
    发明授权
    Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density 有权
    提供改进的传输线完整性和增加路由密度的多层电路基板制造方法

    公开(公告)号：US08962475B2

    公开(公告)日：2015-02-24

    申请号：US14080907

    申请日：2013-11-15

    Applicant: International Business Machines Corporation

    Inventor： Sungjun Chun ,  Anand Haridass ,  Roger D. Weekly

    IPC: H01L21/4763

    CPC classification number: H01L21/76879 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0253 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/0969 ,  H01L2224/0401

    Abstract: An integrated circuit substrate is designed and fabricated with a selectively applied transmission line reference plane metal layer to achieve signal path shielding and isolation, while avoiding drops in impedance due to capacitance between large diameter vias and the transmission line reference plane metal layer. The transmission line reference plane defines voids above (or below) the signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. For voltage-plane bearing PTHs, no voids are introduced, so that signal path conductors can be routed above or adjacent to the voltage-plane bearing PTHs, with the transmission line reference plane preventing shunt capacitance between the signal path conductors and the PTHs.

    Abstract translation: 集成电路衬底被设计和制造，具有选择性地施加的传输线参考平面金属层，以实现信号路径屏蔽和隔离，同时避免由于大直径通孔和传输线参考平面金属层之间的电容引起的阻抗下降。 传输线参考平面定义穿过刚性衬底芯的信号承载电镀通孔（PTH）上方（或下方）的空隙，使得信号不会由于并联电容引起的阻抗失配而降级 从信号承载PTH的顶部（或底部）到传输线参考平面。 对于电压平面轴承PTH，不引入空隙，使得信号路径导体可以路由在电压平面轴承PTH上方或附近，传输线参考平面防止信号路径导体和PTH之间的分流电容。

    System for designing substrates having reference plane voids with strip segments
    6.
    发明授权
    System for designing substrates having reference plane voids with strip segments 有权
    用于设计具有带段的参考平面空隙的基板的系统

    公开(公告)号：US08813000B2

    公开(公告)日：2014-08-19

    申请号：US14042908

    申请日：2013-10-01

    Applicant: International Business Machines Corporation

    Inventor： Sungjun Chun ,  Anand Haridass ,  Roger D. Weekly

    IPC: G06F17/50

    CPC classification number: G06F17/5077 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0253 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49117 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322

    Abstract: Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.

    Abstract translation: 具有带状段互连的通孔上的参考平面空隙的制造电路允许在通孔上路由关键信号路径，同时仅通过插入电容略微增加。 传输线参考平面定义了通过刚性衬底芯的信号承载电镀通孔（PTH）上方（或下方）的空隙，使得信号不会被阻抗失配降级，否则会由分流电容引起 信号承载PTH的顶部（或底部）到传输线参考平面。 为了提供增加的布线密度，信号路径被布置在空隙上，但是通过将导电条包括通过空隙来防止由空隙引起的信号路径的破坏，从而减小与信号承载PTH的耦合并维持 信号路径导体。

    Implementing high-speed signaling via dedicated printed circuit-board media
    7.
    发明授权
    Implementing high-speed signaling via dedicated printed circuit-board media 有权

    公开(公告)号：US11076493B2

    公开(公告)日：2021-07-27

    申请号：US16038417

    申请日：2018-07-18

    Applicant: International Business Machines Corporation

    Inventor： Douglas A. Baska ,  Daniel M. Dreps ,  Rohan U. Mandrekar ,  Roger D. Weekly

    IPC: H05K3/46 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

    Abstract: Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic component; forming, on the first circuit board, second pins that connect to second leads of a second electronic component; affixing the first circuit board to a second circuit board having a first layer with first wires; and forming second wires on a second layer of the second circuit board, wherein said forming the second wires creates an electrical connection on the second circuit board between a portion of the first pins and a portion of the second pins. In some embodiments, the second circuit board is smaller than the first circuit board, and the second layer of the second circuit board is, in length, approximately equivalent to a distance between the first electronic component and the second electronic component.

    Implementing high-speed signaling via dedicated printed circuit-board media
    9.
    发明授权
    Implementing high-speed signaling via dedicated printed circuit-board media 有权

    公开(公告)号：US10034393B2

    公开(公告)日：2018-07-24

    申请号：US14089084

    申请日：2013-11-25

    Applicant: International Business Machines Corporation

    Inventor： Douglas A. Baska ,  Daniel M. Dreps ,  Rohan U. Mandrekar ,  Roger D. Weekly

    IPC: H05K3/46 ,  H05K3/36 ,  H05K1/14 ,  H05K1/02

    Abstract: Some embodiments of the inventive subject matter are directed to forming, on a first circuit board, first pins that connect to first leads of a first electronic component; forming, on the first circuit board, second pins that connect to second leads of a second electronic component; affixing the first circuit board to a second circuit board having a first layer with first wires; and forming second wires on a second layer of the second circuit board, wherein said forming the second wires creates an electrical connection on the second circuit board between a portion of the first pins and a portion of the second pins. In some embodiments, the second circuit board is smaller than the first circuit board, and the second layer of the second circuit board is, in length, approximately equivalent to a distance between the first electronic component and the second electronic component.

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